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采用钝化诱导沟道定义的同质结溶液处理金属氧化物薄膜晶体管。

Homojunction solution-processed metal oxide thin-film transistors using passivation-induced channel definition.

作者信息

Kim Jung Hyun, Rim You Seung, Kim Hyun Jae

机构信息

School of Electrical and Electronic Engineering, Yonsei University , 50 Yonsei-ro, Seodaemun-gu, Seoul 120-749, Republic of Korea.

出版信息

ACS Appl Mater Interfaces. 2014 Apr 9;6(7):4819-22. doi: 10.1021/am405712m. Epub 2014 Mar 24.

Abstract

A simple method of channel passivation and physical definition of solution-processed metal oxide thin-film transistors (TFTs) has been developed for aluminum oxide (AlOx) and indium oxide (InOx) thin films. A photoresist-free-based ultraviolet (UV) patterning process was used to define an InOx layer as the source/drain region and an AlOx layer as a passivation layer on the InOx layer. The Al diffused into the patterned InOx thin film during a thermal annealing step. As an electrode, the patterned InOx thin film had low resistivity, and as a channel, the Al-diffused InOx thin film had a low carrier concentration. Furthermore, the diffused Al behaved as a carrier suppressor by reducing oxygen vacancies within the InOx thin film. We succeeded in forming a coplanar homojunction-structured metal oxide TFT that used the passivation-induced channel-defining (PCD) method with an AlOx/InOx bilayer. The PCD TFT had a field-effect mobility of 0.02 cm(2)/V·s, a threshold voltage of -1.88 V, a subthreshold swing of 0.73 V/decade, and an on/off current ratio of 2.75 × 10(6) with a width/length (W/L) of 2000 μm/400 μm.

摘要

针对氧化铝(AlOx)和氧化铟(InOx)薄膜,开发了一种用于溶液处理金属氧化物薄膜晶体管(TFT)的简单沟道钝化和物理定义方法。采用基于无光刻胶的紫外(UV)图案化工艺,将InOx层定义为源极/漏极区域,将AlOx层定义为InOx层上的钝化层。在热退火步骤中,Al扩散到图案化的InOx薄膜中。作为电极,图案化的InOx薄膜具有低电阻率,而作为沟道,Al扩散的InOx薄膜具有低载流子浓度。此外,扩散的Al通过减少InOx薄膜中的氧空位起到载流子抑制作用。我们成功地使用AlOx/InOx双层的钝化诱导沟道定义(PCD)方法形成了共面同质结结构的金属氧化物TFT。PCD TFT的场效应迁移率为0.02 cm²/V·s,阈值电压为 -1.88 V,亚阈值摆幅为0.73 V/十倍频程,开/关电流比为2.75×10⁶,宽长比(W/L)为2000μm/400μm。

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