Kataoka Taiki, Magari Yusaku, Makino Hisao, Furuta Mamoru
Materials Science and Engineering Course, Kochi University of Technology, Kami 782-8502, Kochi, Japan.
Graduate School of Natural Science and Technology, Shimane University, Matsue 690-8504, Shimane, Japan.
Materials (Basel). 2021 Dec 27;15(1):187. doi: 10.3390/ma15010187.
We successfully demonstrated a transition from a metallic InO film into a nondegenerate semiconductor InO:H film. A hydrogen-doped amorphous InO:H (a-InO:H) film, which was deposited by sputtering in Ar, O, and H gases, could be converted into a polycrystalline InO:H (poly-InO:H) film by low-temperature (250 °C) solid-phase crystallization (SPC). Hall mobility increased from 49.9 cmVs for an a-InO:H film to 77.2 cmVs for a poly-InO:H film. Furthermore, the carrier density of a poly-InO:H film could be reduced by SPC in air to as low as 2.4 × 10 cm, which was below the metal-insulator transition (MIT) threshold. The thin film transistor (TFT) with a metallic poly-InO channel did not show any switching properties. In contrast, that with a 50 nm thick nondegenerate poly-InO:H channel could be fully depleted by a gate electric field. For the InO:H TFTs with a channel carrier density close to the MIT point, maximum and average field effect mobility (μ) values of 125.7 and 84.7 cmVs were obtained, respectively. We believe that a nondegenerate poly-InO:H film has great potential for boosting the μ of oxide TFTs.
我们成功展示了从金属态的InO薄膜到非简并半导体InO:H薄膜的转变。通过在氩气、氧气和氢气中溅射沉积的氢掺杂非晶InO:H(a-InO:H)薄膜,可通过低温(250°C)固相结晶(SPC)转化为多晶InO:H(poly-InO:H)薄膜。霍尔迁移率从a-InO:H薄膜的49.9 cm²V⁻¹s⁻¹增加到poly-InO:H薄膜的77.2 cm²V⁻¹s⁻¹。此外,通过在空气中进行SPC,poly-InO:H薄膜的载流子密度可降低至低至2.4×10¹⁹ cm⁻³,低于金属-绝缘体转变(MIT)阈值。具有金属性多晶InO沟道的薄膜晶体管(TFT)未表现出任何开关特性。相比之下,具有50 nm厚非简并poly-InO:H沟道的TFT可被栅极电场完全耗尽。对于沟道载流子密度接近MIT点的InO:H TFT,分别获得了125.7和84.7 cm²V⁻¹s⁻¹的最大和平均场效应迁移率(μ)值。我们认为非简并poly-InO:H薄膜在提高氧化物TFT的μ方面具有巨大潜力。