Zaman M R, Islam M T, Misran N, Yatim Baharudin
Institute of Space Science (ANGKASA), 43600 UKM Bangi, Malaysia ; Department of Electrical, Electronic and Systems Engineering, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Malaysia.
Department of Electrical, Electronic and Systems Engineering, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Malaysia.
ScientificWorldJournal. 2014;2014:831435. doi: 10.1155/2014/831435. Epub 2014 Apr 6.
A radio frequency (RF) resonator using glass-reinforced epoxy material for C and X band is proposed in this paper. Microstrip line technology for RF over glass-reinforced epoxy material is analyzed. Coupling mechanism over RF material and parasitic coupling performance is explained utilizing even and odd mode impedance with relevant equivalent circuit. Babinet's principle is deployed to explicate the circular slot ground plane of the proposed resonator. The resonator is designed over four materials from different backgrounds which are glass-reinforced epoxy, polyester, gallium arsenide (GaAs), and rogers RO 4350B. Parametric studies and optimization algorithm are applied over the geometry of the microstrip resonator to achieve dual band response for C and X band. Resonator behaviors for different materials are concluded and compared for the same structure. The final design is fabricated over glass-reinforced epoxy material. The fabricated resonator shows a maximum directivity of 5.65 dBi and 6.62 dBi at 5.84 GHz and 8.16 GHz, respectively. The lowest resonance response is less than -20 dB for C band and -34 dB for X band. The resonator is prototyped using LPKF (S63) drilling machine to study the material behavior.
本文提出了一种用于C波段和X波段的采用玻璃纤维增强环氧树脂材料的射频(RF)谐振器。分析了在玻璃纤维增强环氧树脂材料上实现射频的微带线技术。利用奇偶模阻抗和相关等效电路解释了射频材料上的耦合机制和寄生耦合性能。运用巴比涅原理来阐述所提出谐振器的圆形缝隙接地平面。该谐振器是基于四种不同背景的材料设计的,它们分别是玻璃纤维增强环氧树脂、聚酯、砷化镓(GaAs)和罗杰斯RO 4350B。对微带谐振器的几何结构进行了参数研究和优化算法,以实现C波段和X波段的双频响应。总结并比较了相同结构下不同材料的谐振器性能。最终设计是在玻璃纤维增强环氧树脂材料上制作的。制作的谐振器在5.84 GHz和8.16 GHz时的最大方向性分别为5.65 dBi和6.62 dBi。C波段的最低谐振响应小于-20 dB,X波段的最低谐振响应小于-34 dB。使用LPKF(S63)钻孔机制作了谐振器原型,以研究材料性能。