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用于芯片量热计应用的多通道3D热电堆的制造与表征

Fabrication and characterization of a multichannel 3D thermopile for chip calorimeter applications.

作者信息

Huynh Tho Phuoc, Zhang Yilei, Yehuda Cohen

机构信息

School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue 639798, Singapore.

Singapore Centre on Environmental Life Sciences and Engineering, Interdisciplinary Graduate School, Nanyang Technological University, 60 Nanyang Drive 637551, Singapore.

出版信息

Sensors (Basel). 2015 Feb 3;15(2):3351-61. doi: 10.3390/s150203351.

Abstract

Thermal sensors based on thermopiles are some of the most robust and popular temperature sensing technologies across industries and research disciplines. A chip calorimeter with a 3D thermopile layout with a large sensing area and multichannel capacity has been developed, which is highly desired for many applications requiring large reaction chambers or high throughputs, such as biofilm research, drug screening, etc. The performance of the device, including temperature sensitivity and heat power sensitivity, was evaluated. The capability to split the chip calorimeter to multiple channels was also demonstrated, which makes the chip calorimeter very flexible and powerful in many applications.

摘要

基于热电堆的热传感器是跨行业和研究领域中最坚固、最受欢迎的温度传感技术之一。已经开发出一种具有3D热电堆布局、大传感面积和多通道能力的芯片量热仪,这对于许多需要大反应室或高通量的应用(如生物膜研究、药物筛选等)来说是非常需要的。评估了该设备的性能,包括温度灵敏度和热功率灵敏度。还展示了将芯片量热仪拆分为多个通道的能力,这使得芯片量热仪在许多应用中非常灵活且功能强大。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9ce8/4367362/b0fcbeca3b22/sensors-15-03351f1.jpg

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