Laboratory of Optical Materials and Coating (LOMC) Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST) , Daejeon, Republic of Korea.
ACS Appl Mater Interfaces. 2016 Apr 6;8(13):8335-40. doi: 10.1021/acsami.6b01497. Epub 2016 Mar 22.
We report vinyl-phenyl siloxane hybrid material (VPH) that can be used as a matrix for copper-clad laminates (CCLs) for high-frequency applications. The CCLs, with a VPH matrix fabricated via radical polymerization of resin blend consisting of sol-gel-derived linear vinyl oligosiloxane and bulky siloxane monomer, phenyltris(trimethylsiloxy)silane, achieve low dielectric constant (Dk) and dissipation factor (Df). The CCLs with the VPH matrix exhibit excellent dielectric performance (Dk = 2.75, Df = 0.0015 at 1 GHz) with stability in wide frequency range (1 MHz to 10 GHz) and at high temperature (up to 275 °C). Also, the VPH shows good flame resistance without any additives. These results suggest the potential of the VPH for use in high-speed IC boards.
我们报告了一种乙烯基苯基硅氧烷杂化材料（VPH），可作为用于高频应用的覆铜层压板（CCL）的基质。通过由溶胶-凝胶衍生的线性乙烯基低聚硅氧烷和大体积硅氧烷单体苯基三（三甲基硅氧基）硅烷的树脂共混物的自由基聚合制造的 CCL 具有低介电常数（Dk）和损耗因子（Df）。具有 VPH 基质的 CCL 表现出优异的介电性能（在 1 GHz 时为 Dk = 2.75，Df = 0.0015），在宽频率范围（1 MHz 至 10 GHz）和高温（高达 275°C）下稳定。此外，VPH 表现出良好的阻燃性，无需添加任何添加剂。这些结果表明 VPH 有用于高速集成电路板的潜力。
