Promerus, LLC, 225 W. Bartges Street, Akron, OH, 44307, USA.
XLYNX Materials, Inc., Victoria, BC, V8P 5C2, Canada.
Macromol Rapid Commun. 2024 Sep;45(17):e2400200. doi: 10.1002/marc.202400200. Epub 2024 Jul 1.
Thermosets having low dielectric constant (D < 3) and low dielectric dissipation factor (D < 0.003), high glass transition temperature (T > 150 °C), and good adhesion to copper are desirable for the low loss layers of the copper clad laminates (CCL) in next generation printed circuit boards. Three different difunctional diazirines are evaluated for both thermal and photochemical crosslinking of a high T vinyl-addition polynorbornene resin: poly(5-hexyl-1-norbornene) (poly(HNB)). The substrate polymer, crosslinked by the carbenes generated from the activated diazirines, forms thermosets with D < 2.3 and D < 0.001 at 10 GHz depending on the identity of the diazirine and the loading. The D and D values for one composition are stable for 1600 h at 125 °C in air and for 1400 h at 85 °C and 85% relative humidity, suggesting good long-term reliability of this thermoset. Adhesion of poly(HNB) to copper can be enhanced by priming the copper surface with a diazirine prior to high temperature lamination; peel strength values of greater than 7.5 N cm are achieved. Negative-tone photopatterning of poly(HNB) with diazirines upon exposure to 365 nm light is demonstrated.
对于下一代印刷电路板的覆铜层压板 (CCL) 的低损耗层，需要具有低介电常数 (D < 3) 和低介电损耗因子 (D < 0.003)、高玻璃化转变温度 (T > 150°C) 和对铜良好附着力的热固性材料。三种不同的二官能团重氮化合物用于评估热和光化学交联高 T 乙烯加成降冰片烯树脂：聚(5-己基-1-降冰片烯) (poly(HNB))。通过由活化重氮化合物产生的碳烯交联的基底聚合物，形成介电常数为 D < 2.3 和 D < 0.001 的热固性材料，这取决于重氮化合物的种类和负载。在空气中，一种组成的 D 和 D 值在 125°C 下稳定 1600 h，在 85°C 和 85%相对湿度下稳定 1400 h，表明这种热固性材料具有良好的长期可靠性。通过在高温层压前用重氮化合物对铜表面进行预处理，可以增强 poly(HNB)对铜的附着力；实现了大于 7.5 N cm 的剥离强度值。通过在 365nm 光下曝光证明了带有重氮化合物的 poly(HNB)的负性光图案化。
