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使用高分辨率透射X射线显微镜(TXM)对富锡焊料合金进行纳米级三维微观结构表征。

Nanoscale Three-Dimensional Microstructural Characterization of an Sn-Rich Solder Alloy Using High-Resolution Transmission X-Ray Microscopy (TXM).

作者信息

Kaira Chandrashekara S, Mayer Carl R, De Andrade V, De Carlo Francesco, Chawla Nikhilesh

机构信息

1Materials Science and Engineering,Arizona State University,Tempe,AZ 85287-6106,USA.

2Advanced Photon Source,Argonne National Laboratory,Building 401,9700 S. Cass Avenue,Argonne,IL 60439,USA.

出版信息

Microsc Microanal. 2016 Aug;22(4):808-13. doi: 10.1017/S1431927616011429. Epub 2016 Jul 18.

DOI:10.1017/S1431927616011429
PMID:27426439
Abstract

Three-dimensional (3D) nondestructive microstructural characterization was performed using full-field transmission X-ray microscopy on an Sn-rich alloy, at a spatial resolution of 60 nm. This study highlights the use of synchrotron radiation along with Fresnel zone plate optics to perform absorption contrast tomography for analyzing nanoscale features of fine second phase particles distributed in the tin matrix, which are representative of the bulk microstructure. The 3D reconstruction was also used to quantify microstructural details of the analyzed volume.

摘要

使用全场透射X射线显微镜对富锡合金进行了三维(3D)无损微观结构表征,空间分辨率为60纳米。本研究强调了同步辐射与菲涅耳波带片光学器件的结合使用,以进行吸收对比断层扫描,用于分析分布在锡基体中的细小第二相颗粒的纳米级特征,这些颗粒代表了整体微观结构。三维重建还用于量化分析体积的微观结构细节。

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