Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 305-701, Republic of Korea.
Department of Nano Mechanics, Nano-Convergence Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 156 Gajeongbuk-ro, Yuseong-gu, Daejeon, 305-343, Republic of Korea.
Adv Mater. 2016 Oct;28(38):8371-8378. doi: 10.1002/adma.201602339. Epub 2016 Jul 20.
Ultrathin silicon-based flexible 16 × 16 NAND flash memory (f-NAND) is demonstrated utilizing roll-to-plate packaging. The roll-based thermo-compression bonding of the anisotropic conductive film (ACF) transfers and simultaneously interconnects the f-NAND on a flexible printed circuit board. Reliable circuitry operation of the 16 × 16 f-NAND is confirmed with excellent flexibility and stable ACF interconnections.
采用卷对片封装技术展示了超薄硅基 16×16 NAND 闪存（f-NAND）。基于卷的各向异性导电膜（ACF）热压键合将 f-NAND 转移并同时互连到柔性印刷电路板上。通过优异的灵活性和稳定的 ACF 互连，确认了 16×16 f-NAND 的可靠电路操作。
