Selvaraj Karthik, Sampath Vidhya, Sujatha V, Mahalaxmi S
Department of Conservative Dentistry and Endodontics, SRM Dental College, Chennai, Tamil Nadu, India.
Indian J Dent Res. 2016 Jul-Aug;27(4):421-425. doi: 10.4103/0970-9290.191893.
The aim of this in vitro study was to comparatively evaluate the microshear bond strength (MSBS) of etch-and-rinse and self-etch (ER and SE) bonding systems to dentin pretreated with silver diamine fluoride/potassium iodide (SDF/KI) and nanoleakage at the resin-dentin interface using transmission electron microscope (TEM).
Seventy-two dentin slabs of 3 mm thickness were prepared from extracted human permanent third molars and divided into four groups (n = 18) based on the dentin surface treatment as follows: (1) ER adhesive bonding without dentin pretreatment; (2) SDF/KI pretreatment of dentin followed by ER adhesive bonding; (3) SE adhesive bonding without dentin pretreatment; and (4) SDF/KI pretreatment of dentin followed by SE adhesive bonding. Resin composite was built on the dentin slabs to a height of 4 mm incrementally, and dentin-composite beams of approximately 1 mm 2 cross-sectional area were prepared. The beams were subjected to MSBS analysis, and the fractured surface was observed under scanning electron microscope to determine the mode of failure. The resin-dentin interface was examined under TEM for evaluation of nanoleakage.
One-way ANOVA followed by Tukey's post hoc multiple comparison tests.
Pretreatment of dentin with SDF/KI increased the MSBS of ER and SE adhesives, though not statistically significant, except between Groups 2 and 3. In all the groups, the predominant mode of failure was adhesive followed by cohesive in resin, mixed and cohesive in dentin. TEM examination of resin-dentin interface showed that pretreatment with 38% SDF/KI reduced nanoleakage regardless of the type of bonding system used.
Pretreatment of dentin with SDF/KI minimized nanoleakage at the resin-dentin interface without adversely affecting the bond strength of resin composite to dentin.
本体外研究旨在比较评估酸蚀冲洗和自酸蚀(ER和SE)粘结系统与经氟化亚银/碘化钾(SDF/KI)预处理的牙本质之间的微剪切粘结强度(MSBS),并使用透射电子显微镜(TEM)观察树脂-牙本质界面处的纳米渗漏情况。
从拔除的人类恒牙第三磨牙制备72个厚度为3mm的牙本质片,并根据牙本质表面处理分为四组(n = 18),如下:(1)未进行牙本质预处理的ER粘结剂粘结;(2)牙本质经SDF/KI预处理后进行ER粘结剂粘结;(3)未进行牙本质预处理的SE粘结剂粘结;(4)牙本质经SDF/KI预处理后进行SE粘结剂粘结。在牙本质片上逐层构建树脂复合材料至4mm高度,并制备横截面面积约为1mm²的牙本质-复合材料梁。对梁进行MSBS分析,并在扫描电子显微镜下观察断裂表面以确定失败模式。在TEM下检查树脂-牙本质界面以评估纳米渗漏情况。
采用单因素方差分析,随后进行Tukey事后多重比较检验。
用SDF/KI预处理牙本质可提高ER和SE粘结剂的MSBS,尽管无统计学意义,但第2组和第3组之间除外。在所有组中,主要的失败模式是树脂中的粘结性失败,其次是内聚性失败,牙本质中的混合性和内聚性失败。树脂-牙本质界面的TEM检查表明,无论使用何种粘结系统类型,用38% SDF/KI预处理均可减少纳米渗漏。
用SDF/KI预处理牙本质可使树脂-牙本质界面处的纳米渗漏最小化,而不会对树脂复合材料与牙本质的粘结强度产生不利影响。