CENIMAT/I3N Departamento de Ciência dos Materiais, Faculdade de Ciências e Tecnologia (FCT), Universidade NOVA de Lisboa (UNL) and CEMOP/UNINOVA , 2829-516 Caparica, Portugal.
ACS Appl Mater Interfaces. 2016 Nov 16;8(45):31100-31108. doi: 10.1021/acsami.6b06321. Epub 2016 Nov 4.
Solution processing of amorphous metal oxides has lately been used as an option to implement in flexible electronics, allowing a reduction of the associated costs and high performance. However, the research has focused more on the semiconductor layer rather than on the insulator layer, which is related to the stability and performance of the devices. This work aims to evaluate amorphous aluminum oxide thin films produced by combustion synthesis and the influence of far-ultraviolet (FUV) irradiation on the properties of the insulator on thin-film transistors (TFTs) using different semiconductors, in order to have compatibility with flexible substrates. An optimized dielectric layer was obtained for an annealing of 30 min assisted by FUV exposure. These thin films were applied in gallium-indium-zinc oxide TFTs as dielectrics showing the best results for TFTs annealed at 180 °C with FUV irradiation: good reproducibility with a subthreshold slope of 0.11 ± 0.01 V dec and a turn-on voltage of -0.12 ± 0.05 V, low operating voltage, and good stability over time. Finally, the dielectric layer was applied in solution-processed indium oxide (InO) TFTs at low temperature, 180 °C, with a short processing time being compatible with flexible electronic applications.
最近,非晶态金属氧化物的溶液处理已被用作实现柔性电子产品的一种选择,从而降低了相关成本并提高了性能。然而,研究更多地集中在半导体层上,而不是与器件稳定性和性能相关的绝缘体层上。本工作旨在评估通过燃烧合成制备的非晶态氧化铝薄膜,并研究远紫外线(FUV)辐照对使用不同半导体的薄膜晶体管(TFT)中绝缘体性能的影响,以便与柔性衬底兼容。通过 FUV 曝光辅助的 30 分钟退火,获得了优化的介电层。这些薄膜应用于镓-铟-锌氧化物 TFT 中作为电介质,对于在 180°C 下退火并进行 FUV 辐照的 TFT 表现出最佳结果:具有良好的重现性,亚阈值斜率为 0.11 ± 0.01 V dec ,开启电压为-0.12 ± 0.05 V,工作电压低,并且随时间具有良好的稳定性。最后,该介电层应用于低温(180°C)溶液处理的氧化铟(InO)TFT 中,处理时间短,与柔性电子应用兼容。