通过钯催化芳基硅烷与H-膦酸酯经C-Si键裂解的氧化交叉偶联构建Ar-P键。
Ar-P bond construction by the Pd-catalyzed oxidative cross-coupling of arylsilanes with H-phosphonates via C-Si bond cleavage.
作者信息
Luo Haiqing, Liu Haidong, Chen Xingwei, Wang Keke, Luo Xuzhong, Wang Kejun
机构信息
Department of Chemistry & Chemical Engineering, Gannan Normal University, Ganzhou 341000, China.
出版信息
Chem Commun (Camb). 2017 Jan 10;53(5):956-958. doi: 10.1039/c6cc08408g.
PMID:28044148
Abstract
A novel and efficient methodology that allows for the construction of Ar-P bonds via the Pd-catalyzed oxidative cross-coupling reaction of various arylsilanes with H-phosphonates leading to valuable arylphosphonates has been developed.
摘要
一种新颖且高效的方法已经被开发出来，该方法通过钯催化各种芳基硅烷与H-膦酸酯的氧化交叉偶联反应来构建Ar-P键，从而得到有价值的芳基膦酸酯。
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