Zakerin Marjan, Novak Antonin, Toda Masaya, Emery Yves, Natalio Filipe, Butt Hans-Jürgen, Berger Rüdiger
Max Planck Institute for Polymer Research, Ackermannweg 10, 55128 Mainz, Germany.
Laboratoire d'Acoustique de l'Université du Maine (LAUM, UMR CNRS 6613), 72000 Le Mans, France.
Sensors (Basel). 2017 May 23;17(6):1191. doi: 10.3390/s17061191.
In this paper, we apply a digital holographic microscope (DHM) in conjunction with stroboscopic acquisition synchronization. Here, the temperature-dependent decrease of the first resonance frequency (₁()) and Young's elastic modulus (₁()) of silicon micromechanical cantilever sensors (MCSs) are measured. To perform these measurements, the MCSs are uniformly heated from ₀ = 298 K to = 450 K while being externally actuated with a piezo-actuator in a certain frequency range close to their first resonance frequencies. At each temperature, the DHM records the time-sequence of the 3D topographies for the given frequency range. Such holographic data allow for the extracting of the out-of-plane vibrations at any relevant area of the MCSs. Next, the Bode and Nyquist diagrams are used to determine the resonant frequencies with a precision of 0.1 Hz. Our results show that the decrease of resonance frequency is a direct consequence of the reduction of the silicon elastic modulus upon heating. The measured temperature dependence of the Young's modulus is in very good accordance with the previously-reported values, validating the reliability and applicability of this method for micromechanical sensing applications.
在本文中，我们将数字全息显微镜（DHM）与频闪采集同步相结合。在此，我们测量了硅微机械悬臂梁传感器（MCS）的第一共振频率（₁()）和杨氏弹性模量（₁()）随温度的降低情况。为了进行这些测量，在使用压电致动器在接近其第一共振频率的特定频率范围内对MCS进行外部驱动的同时，将MCS从₀ = 298 K均匀加热到 = 450 K。在每个温度下，DHM记录给定频率范围内3D形貌的时间序列。此类全息数据允许提取MCS任何相关区域的面外振动。接下来，使用波特图和奈奎斯特图以0.1 Hz的精度确定共振频率。我们的结果表明，共振频率的降低是加热时硅弹性模量降低的直接结果。所测量的杨氏模量对温度的依赖性与先前报道的值非常吻合，验证了该方法在微机械传感应用中的可靠性和适用性。
