Tran Binh Tinh, Hirayama Hideki
RIKEN Center for Advanced Photonics, 2-1 Hirosawa, Wako, Saitama, 351-0198, Japan.
Department of Electrical Engineering and Computer Science, University of Michigan, 1301 Beal Avenue, Ann Arbor, MI, 48109-2122, United States.
Sci Rep. 2017 Sep 22;7(1):12176. doi: 10.1038/s41598-017-11757-1.
Growing III-V semiconductor materials on Si substrates for opto-electronic applications is challenging because their high lattice mismatch and different thermal expansion coefficients cause the epitaxial layers to have low quality. Here we report the growth of a high-quality AlN template on a micro-circle-patterned Si substrate by using NH pulsed-flow multilayer AlN growth and epitaxial lateral overgrowth techniques. Then, we fabricated and characterized a deep-ultraviolet light-emitting diode (UV-LED) device using this AlN/patterned Si. By using standard lithography and inductively coupled plasma etching, the Si substrate was prepared with very high pattern density and was made deep enough to grow a thick AlN template with high crystal quality and very few threading dislocations, allowing for further re-growth of the deep UV-LED device. And by combining a transparent p-AlGaN contact layer, an electron blocking layer and using this high quality AlN template: a deep UV-LED device fabricated and showed a strong single sharp electroluminescence (EL) peak at 325 nm and achieved an external quantum efficiency (EQE) of about 0.03%, for a deep UV-LED grown on Si substrate.
在硅衬底上生长用于光电子应用的III-V族半导体材料具有挑战性,因为它们的高晶格失配和不同的热膨胀系数会导致外延层质量较低。在此,我们报告了通过使用NH脉冲流多层AlN生长和外延横向生长技术,在微圆形图案化硅衬底上生长高质量AlN模板的情况。然后,我们使用这种AlN/图案化硅制造并表征了深紫外发光二极管(UV-LED)器件。通过使用标准光刻和电感耦合等离子体蚀刻,制备了具有非常高图案密度的硅衬底,并且蚀刻得足够深,以生长具有高晶体质量和极少位错的厚AlN模板,从而允许深紫外LED器件进一步生长。并且通过结合透明的p-AlGaN接触层、电子阻挡层并使用这种高质量的AlN模板:制造出的深紫外LED器件在325nm处显示出强烈的单尖锐电致发光(EL)峰,并且对于在硅衬底上生长的深紫外LED,实现了约0.03%的外量子效率(EQE)。