Xu Pengfei, Zhang Yanfeng, Shao Zengkai, Liu Lin, Zhou Lidan, Yang Chunchuan, Chen Yujie, Yu Siyuan
Opt Lett. 2017 Sep 1;42(17):3391-3394. doi: 10.1364/OL.42.003391.
The chip-fiber grating coupler is a fundamental building block in integrated photonics, providing convenient on-wafer testing and packaging. Couplers based on a silicon nitride (SiN) material platform can achieve wider bandwidths than silicon-based couplers, but suffer from lower efficiency due to the relative low material refractive index. The efficiency of the SiN grating coupler can be improved by using high-reflectivity silicon grating reflectors underneath. However, such a silicon grating reflector requires several fabrication steps, including lithography, etching, high precision alignment (HPA), and chemical mechanical polishing (CMP). In this Letter, we demonstrate an easy-to-fabricate SiN-on-SOI transverse-electric mode grating coupler requiring only one patterning step (grating alone), and without the need for HPA and CMP. A coupling coefficient of -2.5 dB and 1-dB-bandwidth of 65 nm has been experimentally measured.
芯片光纤光栅耦合器是集成光子学中的基本构建模块,可提供便捷的晶圆上测试和封装。基于氮化硅(SiN)材料平台的耦合器比基于硅的耦合器可实现更宽的带宽,但由于材料折射率相对较低而效率较低。通过在下方使用高反射率硅光栅反射器可以提高SiN光栅耦合器的效率。然而,这种硅光栅反射器需要几个制造步骤,包括光刻、蚀刻、高精度对准(HPA)和化学机械抛光(CMP)。在本信函中,我们展示了一种易于制造的硅上绝缘体(SOI)横向电模式光栅耦合器,仅需一个图案化步骤(仅光栅),且无需HPA和CMP。实验测量得到的耦合系数为-2.5 dB,1 dB带宽为65 nm。