Liu Yang, Zhang Jiasen, Liu Huaping, Wang Sheng, Peng Lian-Mao
Key Laboratory for the Physics and Chemistry of Nanodevices and Academy for Advanced Interdisciplinary Studies, Peking University, Beijing 100871, China.
Key Laboratory for the Physics and Chemistry of Nanodevices and Department of Electronics, Peking University, Beijing 100871, China.
Sci Adv. 2017 Oct 20;3(10):e1701456. doi: 10.1126/sciadv.1701456. eCollection 2017 Oct.
In the post-Moore era, an electrically driven monolithic optoelectronic integrated circuit (OEIC) fabricated from a single material is pursued globally to enable the construction of wafer-scale compact computing systems with powerful processing capabilities and low-power consumption. We report a monolithic plasmonic interconnect circuit (PIC) consisting of a photovoltaic (PV) cascading detector, Au-strip waveguides, and electrically driven surface plasmon polariton (SPP) sources. These components are fabricated from carbon nanotubes (CNTs) via a CMOS (complementary metal-oxide semiconductor)-compatible doping-free technique in the same feature size, which can be reduced to deep-subwavelength scale (~λ/7 to λ/95, λ = 1340 nm) compared with the 14-nm technique node. An OEIC could potentially be configured as a repeater for data transport because of its "photovoltaic" operation mode to transform SPP energy directly into electricity to drive subsequent electronic circuits. Moreover, chip-scale throughput capability has also been demonstrated by fabricating a 20 × 20 PIC array on a 10 mm × 10 mm wafer. Tailoring photonics for monolithic integration with electronics beyond the diffraction limit opens a new era of chip-level nanoscale electronic-photonic systems, introducing a new path to innovate toward much faster, smaller, and cheaper computing frameworks.
在摩尔时代之后，全球都在追求由单一材料制成的电驱动单片光电集成电路（OEIC），以构建具有强大处理能力和低功耗的晶圆级紧凑型计算系统。我们报告了一种单片等离子体互连电路（PIC），它由光伏（PV）级联探测器、金带波导和电驱动表面等离子体激元（SPP）源组成。这些组件通过与CMOS（互补金属氧化物半导体）兼容的无掺杂技术，以相同的特征尺寸由碳纳米管（CNT）制成，与14纳米技术节点相比，该尺寸可缩小至深亚波长尺度（~λ/7至λ/95，λ = 1340纳米）。由于其“光伏”操作模式可将SPP能量直接转化为电能以驱动后续电子电路，OEIC有可能被配置为数据传输的中继器。此外，通过在10毫米×10毫米的晶圆上制造20×20的PIC阵列，也展示了芯片级的吞吐量能力。突破衍射极限定制光子学以实现与电子学的单片集成，开启了芯片级纳米尺度电子 - 光子系统的新时代，为朝着更快、更小、更便宜的计算框架创新引入了一条新路径。
