Wang Zhi, Jiang Lan, Li Xiaowei, Wang Andong, Yao Zhulin, Zhang Kaihu, Lu Yongfeng
Opt Lett. 2018 Jan 1;43(1):98-101. doi: 10.1364/OL.43.000098.
We proposed combining temporally shaped (double-pulse train) laser pulses with spatially shaped (Bessel beam) laser pulses. By using a temporally shaped femtosecond laser Bessel-beam-assisted chemical etching method, the energy deposition efficiency was improved by adjusting the pulse delay to yield a stronger material modification and, thus, a higher etching depth. The etching depth was enhanced by a factor of 13 using the temporally shaped Bessel beam. The mechanism of etching depth enhancement was elucidated by localized transient-free electrons dynamics-induced structural and morphological changes. Micro-Raman spectroscopy was conducted to verify the structural changes inside the material. This method enables high-throughput, high-aspect-ratio microchannel fabrication in fused silica for potential applications in microfluidics.
我们提出将时间整形（双脉冲序列）激光脉冲与空间整形（贝塞尔光束）激光脉冲相结合。通过使用时间整形飞秒激光贝塞尔光束辅助化学蚀刻方法，通过调整脉冲延迟提高了能量沉积效率，以产生更强的材料改性，从而获得更高的蚀刻深度。使用时间整形贝塞尔光束时，蚀刻深度提高了13倍。通过局部无瞬态电子动力学引起的结构和形态变化阐明了蚀刻深度增加的机制。进行了显微拉曼光谱分析以验证材料内部的结构变化。该方法能够在熔融石英中实现高通量、高纵横比微通道制造，有望应用于微流体领域。
