Pennelli G, Dimaggio E, Macucci M
Dipartimento di Ingegneria della Informazione, Università di Pisa, Via G.Caruso, I-56122 Pisa, Italy.
Rev Sci Instrum. 2018 Jan;89(1):016104. doi: 10.1063/1.5008807.
Conventional techniques for thermal conductivity measurements can lead to unreliable results when applied to nanostructures because heaters and temperature sensors needed for the measurement cannot have a negligible size and therefore perturb the result. In this paper, we focus on the 3ω technique, applied to the evaluation of the thermal conductivity of suspended silicon nanoribbons. We introduce a numerical approach based on the finite element solution of the electrical and thermal transport equations and compare its results with those of conventional methods. We show that with our approach we achieve an excellent fit of the experimental data, in particular, for nanostructured materials.
当将传统的热导率测量技术应用于纳米结构时，可能会得出不可靠的结果，因为测量所需的加热器和温度传感器的尺寸不能忽略不计，因此会干扰测量结果。在本文中，我们重点研究了应用于评估悬浮硅纳米带热导率的3ω技术。我们引入了一种基于电和热传输方程有限元解的数值方法，并将其结果与传统方法的结果进行比较。我们表明，通过我们的方法，我们能够很好地拟合实验数据，特别是对于纳米结构材料。
