Park Jae Hyeon, Kim Tae Whan
Department of Electronics and Computer Engineering, Hanyang University, Seoul 04763, Korea.
J Nanosci Nanotechnol. 2018 Mar 1;18(3):1940-1943. doi: 10.1166/jnn.2018.14999.
Self-heating effect (SHE) on the electrical characteristics of fin field-effect transistors (FinFETs) model with a strained Si channel was investigated by using a three-dimensional simulation tool. Strain was applied from 0.1 to 2.0 GPa by changing Si mole fraction of the Si1-xGex. Simulation results showed that the drain current of the strained Si FinFETs increased with increasing applied strain from 0.5 to 2.0 GPa. The drain current of the FinFETs under strain of 2.0 GPa increased up to 20.59 μA. While the drain current of the FinFETs without a SHE increased with increasing strain, the increase of the drain current generating from the strain interrupted the applications for the practical device operation due to a large SHE. The drain current decreased due to the increased scattering resulting from the increased device temperature with an increase in the SHE.
利用三维模拟工具研究了具有应变硅沟道的鳍式场效应晶体管(FinFET)模型的自热效应(SHE)对其电学特性的影响。通过改变Si1-xGex的Si摩尔分数,施加0.1至2.0 GPa的应变。模拟结果表明,应变硅FinFET的漏极电流随着施加应变从0.5 GPa增加到2.0 GPa而增大。在2.0 GPa应变下,FinFET的漏极电流增加到20.59 μA。虽然没有自热效应的FinFET的漏极电流随着应变增加而增大,但由于较大的自热效应,应变产生的漏极电流增加中断了实际器件操作的应用。随着自热效应增加,器件温度升高导致散射增加,漏极电流降低。