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本文引用的文献

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Three-Dimensional Multiscale, Multistable, and Geometrically Diverse Microstructures with Tunable Vibrational Dynamics Assembled by Compressive Buckling.通过压缩屈曲组装的具有可调振动动力学的三维多尺度、多稳态和几何多样的微结构。
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Mechanical assembly of complex, 3D mesostructures from releasable multilayers of advanced materials.利用先进材料的可释放多层结构进行复杂三维介观结构的机械组装。
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三维硅电子系统通过压缩屈曲工艺制造。

Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process.

机构信息

Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Neurological Surgery, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute & Feinberg Medical School, Center for Bio-Integrated Electronics , Northwestern University , Evanston , Illinois 60208 , United States.

Frederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.

出版信息

ACS Nano. 2018 May 22;12(5):4164-4171. doi: 10.1021/acsnano.8b00180. Epub 2018 Apr 17.

DOI:10.1021/acsnano.8b00180
PMID:29641889
原文链接:
https://pmc.ncbi.nlm.nih.gov/articles/PMC5986289/
Abstract

Recently developed approaches in deterministic assembly allow for controlled, geometric transformation of two-dimensional structures into complex, engineered three-dimensional layouts. Attractive features include applicability to wide ranging layout designs and dimensions along with the capacity to integrate planar thin film materials and device layouts. The work reported here establishes further capabilities for directly embedding high-performance electronic devices into the resultant 3D constructs based on silicon nanomembranes (Si NMs) as the active materials in custom devices or microscale components released from commercial wafer sources. Systematic experimental studies and theoretical analysis illustrate the key ideas through varied 3D architectures, from interconnected bridges and coils to extended chiral structures, each of which embed n-channel Si NM MOSFETs (nMOS), Si NM diodes, and p-channel silicon MOSFETs (pMOS). Examples in stretchable/deformable systems highlight additional features of these platforms. These strategies are immediately applicable to other wide-ranging classes of materials and device technologies that can be rendered in two-dimensional layouts, from systems for energy storage, to photovoltaics, optoelectronics, and others.

摘要

最近发展的确定性组装方法允许将二维结构可控地、几何地转化为复杂的工程三维结构。吸引人的特点包括适用于广泛的布局设计和尺寸,以及集成平面薄膜材料和器件布局的能力。这里报道的工作进一步建立了能力,可基于硅纳米膜 (Si NM) 将高性能电子器件直接嵌入到所得的 3D 结构中,Si NM 是定制器件或从商业晶圆源释放的微尺度组件中的有源材料。系统的实验研究和理论分析通过各种 3D 结构说明了关键思想,包括互连的桥梁和线圈到扩展的手性结构,每个结构都嵌入了 n 沟道硅 NM MOSFET(nMOS)、硅 NM 二极管和 p 沟道硅 MOSFET(pMOS)。在可拉伸/可变形系统中的例子突出了这些平台的其他特点。这些策略可立即应用于其他广泛的材料和器件技术类别,这些技术可以在二维布局中呈现,从储能系统到光伏、光电和其他系统。

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