Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou, 310027, China.
Sci Rep. 2018 Sep 20;8(1):14121. doi: 10.1038/s41598-018-32152-4.
Thermal management of the system consisting of epidermal electronics devices (EEDs) and skin is critically important since a few degrees in temperature increase may induce thermal discomfort. In this paper, considering insensible sweating, a three-dimensional analytical thermal model, validated by finite element analysis, is developed to derive analytical expressions for the steady temperature distributions in the EED/skin system. The influences of various parameters including the thickness and thermal conductivity of the substrate in EEDs on the maximum skin temperature are investigated. The comfort analysis is then carried out based on the model to provide design guidelines for optimizing the geometric and material properties of EEDs to avoid the adverse thermal effects. These results pave the theoretical foundation for thermal management of EEDs/skin system in practical applications.
由于温度升高几度可能会引起热不适，因此包含表皮电子设备（EEDs）和皮肤的系统的热管理至关重要。在本文中，考虑到不感蒸发，开发了一个三维分析热模型，通过有限元分析进行了验证，以推导出 EED/皮肤系统中稳态温度分布的解析表达式。研究了各种参数的影响，包括 EEDs 中基底的厚度和热导率对最大皮肤温度的影响。然后基于该模型进行舒适分析，为优化 EEDs 的几何和材料特性以避免不利的热效应提供设计准则。这些结果为实际应用中 EEDs/皮肤系统的热管理奠定了理论基础。
