Cui Yun, Li Yuhang, Xing Yufeng, Yang Tianzhi, Song Jizhou
Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China.
Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China.
Micromachines (Basel). 2016 Nov 18;7(11):210. doi: 10.3390/mi7110210.
A one-dimensional analytic thermal model for the flexible electronic devices integrated with human skin under a constant and pulsed power is developed. The Fourier heat conduction equation is adopted for the flexible electronics devices while the Pennes bio-heat transfer equation is adopted for the skin tissue. Finite element analysis is performed to validate the analytic model through the comparison of temperature distributions in the system. The influences of geometric and loading parameters on the temperature increase under a pulsed power are investigated. It is shown that a small duty cycle can reduce the temperature increase of the system effectively. A thin substrate can reduce the device temperature but increase the skin surface temperature. The results presented may be helpful to optimize the design of flexible electronic devices to reduce the adverse thermal influences in bio-integrated applications.
建立了一个一维解析热模型，用于研究在恒定功率和脉冲功率下与人体皮肤集成的柔性电子器件。柔性电子器件采用傅里叶热传导方程，而皮肤组织采用彭尼斯生物热传递方程。通过有限元分析，比较系统中的温度分布来验证解析模型。研究了几何参数和加载参数对脉冲功率作用下温度升高的影响。结果表明，小占空比可有效降低系统的温度升高。薄基板可降低器件温度，但会提高皮肤表面温度。所得结果可能有助于优化柔性电子器件的设计，以减少生物集成应用中的不利热影响。
