Xie Shuting, Wu Jun, Tang Biao, Zhou Guofu, Jin Mingliang, Shui Lingling
Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics & Joint International Research Laboratory of Optical Information of the Chinese Ministry of Education, South China Normal University, Guangzhou 510006, China.
Micromachines (Basel). 2017 Jul 12;8(7):218. doi: 10.3390/mi8070218.
One of the key fabrication steps of large-area microfluidic devices is the flexible-to-hard sheet alignment and pre-bonding. In this work, the vacuum airbag laminator (VAL) which is commonly used for liquid crystal display (LCD) production has been applied for large-area microfluidic device fabrication. A straightforward, efficient, and low-cost method has been achieved for 400 × 500 mm² microfluidic device fabrication. VAL provides the advantages of precise alignment and lamination without bubbles. Thermal treatment has been applied to achieve strong PDMS⁻glass and PDMS⁻PDMS bonding with maximum breakup pressure of 739 kPa, which is comparable to interference-assisted thermal bonding method. The fabricated 152 × 152 mm² microfluidic chip has been successfully applied for droplet generation and splitting.
大面积微流控器件的关键制造步骤之一是柔性片与硬质片的对准和预键合。在这项工作中，常用于液晶显示器（LCD）生产的真空气囊层压机（VAL）已被应用于大面积微流控器件的制造。对于400×500 mm²的微流控器件制造，已经实现了一种直接、高效且低成本的方法。VAL具有精确对准和层压且无气泡的优点。已经应用热处理来实现牢固的聚二甲基硅氧烷（PDMS）-玻璃和PDMS-PDMS键合，最大破裂压力为739 kPa，这与干涉辅助热键合法相当。所制造的152×152 mm²微流控芯片已成功应用于液滴的产生和分裂。
