Gong Yao, Park Jang Min, Lim Jiseok
School of Mechanical Engineering, Yeungnam University, Daehakro 280, Gyeongsan, 38541 Gyeongbuk, Korea.
Micromachines (Basel). 2016 Nov 22;7(11):211. doi: 10.3390/mi7110211.
Solutions for the bonding and sealing of micro-channels in the manufacturing process of microfluidic devices are limited; therefore, further technical developments are required to determine these solutions. In this study, a new bonding method for thermoplastic microfluidic devices was developed by combining an interference fit with a thermal treatment at low pressure. This involved a process of first injection molding thermoplastic substrates with a microchannel structure, and then performing bonding experiments at different bonding conditions. The results indicated the successful bonding of microchannels over a wide range of bonding pressures with the help of the interference fit. The study also determined additional advantages of the proposed bonding method by comparing the method with the conventional thermal bonding method.
微流控设备制造过程中微通道的键合和密封解决方案有限；因此，需要进一步的技术发展来确定这些解决方案。在本研究中，通过将过盈配合与低压热处理相结合，开发了一种用于热塑性微流控设备的新型键合方法。这包括首先注塑具有微通道结构的热塑性基板，然后在不同的键合条件下进行键合实验的过程。结果表明，借助过盈配合，微通道在很宽的键合压力范围内成功键合。该研究还通过将该方法与传统热键合方法进行比较，确定了所提出键合方法的其他优点。
