Core-Shell Transformation-Imprinted Solder Bumps Enabling Low-Temperature Fluidic Self-Assembly and Self-Alignment of Chips and High Melting Point Interconnects.

We demonstrate the realization of core-shell transformation-imprinted solder bumps to enable low-temperature chip assembly, while providing a route to high-temperature interconnects through transformation. The reported core-shell solder bump uses a lower melting point BiIn-based shell and a higher melting point Sn core in the initial stage. The bumps enable fluidic self-assembly and self-alignment at relatively low temperatures (60-80 °C). The bumps use the high surface free energy of the liquid shell during the self-assembly to capture freely suspended Si dies inside a heated (80 °C) water bath, leading to well-ordered defect-free chip arrays; the molten liquid shell wets the metal contact (binding site) on the chips and yields self-aligned and electrically connected devices. The solid core provides the anchor point to the substrate. After the completion of the assembly, a short reflow raises the melting point, yielding a solid electrical connection. The low melting point liquid diffuses into the high melting point core. The tuning of the material ratios leads to tailored transformation-imprinted solders with high melting points (160-206 °C) in the final structure.