• 文献检索
  • 文档翻译
  • 深度研究
  • 学术资讯
  • Suppr Zotero 插件Zotero 插件
  • 邀请有礼
  • 套餐&价格
  • 历史记录
应用&插件
Suppr Zotero 插件Zotero 插件浏览器插件Mac 客户端Windows 客户端微信小程序
定价
高级版会员购买积分包购买API积分包
服务
文献检索文档翻译深度研究API 文档MCP 服务
关于我们
关于 Suppr公司介绍联系我们用户协议隐私条款
关注我们

Suppr 超能文献

核心技术专利：CN118964589B侵权必究
粤ICP备2023148730 号-1Suppr @ 2026

文献检索

告别复杂PubMed语法，用中文像聊天一样搜索，搜遍4000万医学文献。AI智能推荐，让科研检索更轻松。

立即免费搜索

文件翻译

保留排版，准确专业，支持PDF/Word/PPT等文件格式，支持 12+语言互译。

免费翻译文档

深度研究

AI帮你快速写综述，25分钟生成高质量综述，智能提取关键信息，辅助科研写作。

立即免费体验

功能器件与系统的层尺度和芯片尺度转移技术综述

Layer-Scale and Chip-Scale Transfer Techniques for Functional Devices and Systems: A Review.

作者信息

Gong Zheng

机构信息

Institute of Semiconductors, Guangdong Academy of Sciences, No. 363 Changxing Road, Tianhe District, Guangzhou 510650, China.

Foshan Debao Display Technology Co Ltd., Room 508-1, Level 5, Block A, Golden Valley Optoelectronics, Nanhai District, Foshan 528200, China.

出版信息

Nanomaterials (Basel). 2021 Mar 25;11(4):842. doi: 10.3390/nano11040842.

DOI:10.3390/nano11040842
PMID:33806237
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC8065746/
Abstract

Hetero-integration of functional semiconductor layers and devices has received strong research interest from both academia and industry. While conventional techniques such as pick-and-place and wafer bonding can partially address this challenge, a variety of new layer transfer and chip-scale transfer technologies have been developed. In this review, we summarize such transfer techniques for heterogeneous integration of ultrathin semiconductor layers or chips to a receiving substrate for many applications, such as microdisplays and flexible electronics. We showed that a wide range of materials, devices, and systems with expanded functionalities and improved performance can be demonstrated by using these technologies. Finally, we give a detailed analysis of the advantages and disadvantages of these techniques, and discuss the future research directions of layer transfer and chip transfer techniques.

摘要

功能性半导体层与器件的异质集成已引起学术界和工业界的浓厚研究兴趣。虽然诸如拾取和放置以及晶圆键合等传统技术可以部分应对这一挑战，但已开发出多种新的层转移和芯片级转移技术。在本综述中，我们总结了此类用于将超薄半导体层或芯片异质集成到接收基板以用于许多应用（如微显示器和柔性电子器件）的转移技术。我们表明，通过使用这些技术可以展示出具有扩展功能和改进性能的广泛材料、器件和系统。最后，我们对这些技术的优缺点进行了详细分析，并讨论了层转移和芯片转移技术的未来研究方向。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/fd20787b9cae/nanomaterials-11-00842-g028.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/84982c94f36b/nanomaterials-11-00842-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/65c4505f34a2/nanomaterials-11-00842-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/64251e2ea284/nanomaterials-11-00842-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/ee4f647b93a5/nanomaterials-11-00842-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/910cf913d5b4/nanomaterials-11-00842-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/44a1b102baaf/nanomaterials-11-00842-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/80d1be61a10b/nanomaterials-11-00842-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/e53250f0d7f9/nanomaterials-11-00842-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/e03f580e2ebc/nanomaterials-11-00842-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/3662f79ecaa9/nanomaterials-11-00842-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/48fa08d15fd8/nanomaterials-11-00842-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/73f07748b6df/nanomaterials-11-00842-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/31c76c11dabf/nanomaterials-11-00842-g013.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/71935e9a1c7e/nanomaterials-11-00842-g014.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/488d95bbff3e/nanomaterials-11-00842-g015.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/85b6556859fb/nanomaterials-11-00842-g016.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/f060d142e3c9/nanomaterials-11-00842-g017.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/e5585e2e1de3/nanomaterials-11-00842-g018.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/c294f3c235a7/nanomaterials-11-00842-g019.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/cf7106d9face/nanomaterials-11-00842-g020.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/c865207a4afa/nanomaterials-11-00842-g021.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/95c97ad275ff/nanomaterials-11-00842-g022.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/be5b46ce8c80/nanomaterials-11-00842-g023.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/4943c056d330/nanomaterials-11-00842-g024.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/7c8d07eee166/nanomaterials-11-00842-g025.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/cd84c357ed00/nanomaterials-11-00842-g026.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/17bf2990f4ce/nanomaterials-11-00842-g027.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/fd20787b9cae/nanomaterials-11-00842-g028.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/84982c94f36b/nanomaterials-11-00842-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/65c4505f34a2/nanomaterials-11-00842-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/64251e2ea284/nanomaterials-11-00842-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/ee4f647b93a5/nanomaterials-11-00842-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/910cf913d5b4/nanomaterials-11-00842-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/44a1b102baaf/nanomaterials-11-00842-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/80d1be61a10b/nanomaterials-11-00842-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/e53250f0d7f9/nanomaterials-11-00842-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/e03f580e2ebc/nanomaterials-11-00842-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/3662f79ecaa9/nanomaterials-11-00842-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/48fa08d15fd8/nanomaterials-11-00842-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/73f07748b6df/nanomaterials-11-00842-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/31c76c11dabf/nanomaterials-11-00842-g013.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/71935e9a1c7e/nanomaterials-11-00842-g014.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/488d95bbff3e/nanomaterials-11-00842-g015.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/85b6556859fb/nanomaterials-11-00842-g016.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/f060d142e3c9/nanomaterials-11-00842-g017.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/e5585e2e1de3/nanomaterials-11-00842-g018.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/c294f3c235a7/nanomaterials-11-00842-g019.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/cf7106d9face/nanomaterials-11-00842-g020.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/c865207a4afa/nanomaterials-11-00842-g021.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/95c97ad275ff/nanomaterials-11-00842-g022.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/be5b46ce8c80/nanomaterials-11-00842-g023.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/4943c056d330/nanomaterials-11-00842-g024.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/7c8d07eee166/nanomaterials-11-00842-g025.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/cd84c357ed00/nanomaterials-11-00842-g026.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/17bf2990f4ce/nanomaterials-11-00842-g027.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4d09/8065746/fd20787b9cae/nanomaterials-11-00842-g028.jpg

相似文献

1
Layer-Scale and Chip-Scale Transfer Techniques for Functional Devices and Systems: A Review.功能器件与系统的层尺度和芯片尺度转移技术综述
Nanomaterials (Basel). 2021 Mar 25;11(4):842. doi: 10.3390/nano11040842.
2
Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G.异质晶圆键合技术与薄膜转移技术——面向5G及以后下一代应用的赋能平台。
Micromachines (Basel). 2021 Aug 11;12(8):946. doi: 10.3390/mi12080946.
3
Ultrathin Crystalline Silicon Nano and Micro Membranes with High Areal Density for Low-Cost Flexible Electronics.用于低成本柔性电子器件的具有高面密度的超薄晶体硅纳米和微膜
Small. 2023 Sep;19(39):e2302597. doi: 10.1002/smll.202302597. Epub 2023 May 28.
4
Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates.通过将结构、芯片和电气元件从刚性基板转移到柔性基板来生产柔性电子产品的范式转变集成技术。
Micromachines (Basel). 2023 Feb 10;14(2):415. doi: 10.3390/mi14020415.
5
Van der Waals Layer Transfer of 2D Materials for Monolithic 3D Electronic System Integration: Review and Outlook.二维材料的范德华层转移用于整体 3D 电子系统集成：综述与展望。
ACS Nano. 2023 Feb 14;17(3):1831-1844. doi: 10.1021/acsnano.2c10737. Epub 2023 Jan 19.
6
Wafer-scale integration of sacrificial nanofluidic chips for detecting and manipulating single DNA molecules.牺牲型纳流控芯片的晶圆级集成用于检测和操控单个 DNA 分子。
Nat Commun. 2017 Jan 23;8:14243. doi: 10.1038/ncomms14243.
7
Flexible Electronics toward Wearable Sensing.柔性电子学：走向可穿戴传感
Acc Chem Res. 2019 Mar 19;52(3):523-533. doi: 10.1021/acs.accounts.8b00500. Epub 2019 Feb 15.
8
Fabrication Technologies for the On-Chip Integration of 2D Materials.二维材料芯片集成的制造技术。
Small Methods. 2022 Mar;6(3):e2101435. doi: 10.1002/smtd.202101435. Epub 2022 Jan 7.
9
Large-Scale Uniform-Patterned Arrays of Ultrathin All-2D Vertical Stacked Photodetector Devices.大面积均匀图案化的超薄全二维垂直堆叠光电探测器阵列
ACS Appl Mater Interfaces. 2021 Jul 28;13(29):34696-34704. doi: 10.1021/acsami.1c05136. Epub 2021 Jul 19.
10
Nanoscale Layer Transfer by Hydrogen Ion-Cut Processing: A Brief Review Through Recent U.S. Patents.通过氢离子切割工艺进行的纳米级层转移：基于近期美国专利的简要综述
Recent Pat Nanotechnol. 2017;11(1):42-49. doi: 10.2174/1872210510666160816164410.

引用本文的文献

1
Comparative Analysis of Optoelectrical Performance in Laser Lift-Off Process for GaN-Based Green Micro-LED Arrays.基于GaN的绿色微发光二极管阵列激光剥离工艺中的光电性能比较分析
Nanomaterials (Basel). 2023 Jul 30;13(15):2213. doi: 10.3390/nano13152213.
2
Concurrent self-assembly of RGB microLEDs for next-generation displays.用于新一代显示器的 RGB 微 LED 的并发自组装。
Nature. 2023 May;617(7960):287-291. doi: 10.1038/s41586-023-05889-w. Epub 2023 May 3.

本文引用的文献

1
Control of the Mechanical Adhesion of III-V Materials Grown on Layered h-BN.层状六方氮化硼上生长的III-V族材料的机械附着力控制
ACS Appl Mater Interfaces. 2020 Dec 9;12(49):55460-55466. doi: 10.1021/acsami.0c16850. Epub 2020 Nov 25.
2
Fabrication and chemical lift-off of sub-micron scale III-nitride LED structures.亚微米级III族氮化物发光二极管结构的制备与化学剥离
Opt Express. 2020 Nov 9;28(23):35038-35046. doi: 10.1364/OE.403299.
3
Selective Transfer of Light-Emitting Diodes onto a Flexible Substrate via Laser Lissajous Scanning.
通过激光李萨如图形扫描将发光二极管选择性转移到柔性基板上。
ACS Omega. 2020 Oct 22;5(43):27749-27755. doi: 10.1021/acsomega.0c01425. eCollection 2020 Nov 3.
4
Printed, Wireless, Soft Bioelectronics and Deep Learning Algorithm for Smart Human-Machine Interfaces.印刷、无线、软生物电子学和深度学习算法用于智能人机界面。
ACS Appl Mater Interfaces. 2020 Nov 4;12(44):49398-49406. doi: 10.1021/acsami.0c14193. Epub 2020 Oct 21.
5
Advanced Nanomaterials, Printing Processes, and Applications for Flexible Hybrid Electronics.用于柔性混合电子学的先进纳米材料、印刷工艺及应用
Materials (Basel). 2020 Aug 13;13(16):3587. doi: 10.3390/ma13163587.
6
Fully Integrated, Stretchable, Wireless Skin-Conformal Bioelectronics for Continuous Stress Monitoring in Daily Life.用于日常生活中连续应力监测的全集成、可拉伸、无线皮肤贴合生物电子器件。
Adv Sci (Weinh). 2020 Jun 15;7(15):2000810. doi: 10.1002/advs.202000810. eCollection 2020 Aug.
7
Graphene-Assisted Quasi-van der Waals Epitaxy of AlN Film on Nano-Patterned Sapphire Substrate for Ultraviolet Light Emitting Diodes.用于紫外发光二极管的纳米图案蓝宝石衬底上AlN薄膜的石墨烯辅助准范德华外延生长
J Vis Exp. 2020 Jun 25(160). doi: 10.3791/60167.
8
All-printed nanomembrane wireless bioelectronics using a biocompatible solderable graphene for multimodal human-machine interfaces.采用生物相容性可焊接石墨烯的全印刷纳米膜无线生物电子学，用于多模式人机界面。
Nat Commun. 2020 Jul 10;11(1):3450. doi: 10.1038/s41467-020-17288-0.
9
3D Printed, Customizable, and Multifunctional Smart Electronic Eyeglasses for Wearable Healthcare Systems and Human-Machine Interfaces.3D 打印、可定制、多功能智能电子眼镜，用于可穿戴医疗保健系统和人机界面。
ACS Appl Mater Interfaces. 2020 May 13;12(19):21424-21432. doi: 10.1021/acsami.0c03110. Epub 2020 May 4.
10
Universal SMP gripper with massive and selective capabilities for multiscaled, arbitrarily shaped objects.具有针对多尺度、任意形状物体的大规模和选择性抓取能力的通用SMP夹爪。
Sci Adv. 2020 Feb 14;6(7):eaay5120. doi: 10.1126/sciadv.aay5120. eCollection 2020 Feb.