School of Materials Science of Engineering , University of Science and Technology of China , Shenyang , 110016 , China.
Institute of Metal Research , Chinese Academy of Sciences , Shenyang , 110016 , China.
ACS Appl Mater Interfaces. 2019 Jan 9;11(1):125-136. doi: 10.1021/acsami.8b14038. Epub 2018 Dec 21.
In order to develop a novel kind of antibacterial Cu-containing TiN film with good corrosion resistance, impressive mechanical properties, and low cytotoxicity, three differently designed multilayer films of TiCu/TiCuN multilayer (M1, M2, M3) were deposited on the surface of 316L stainless steel surface using the axial magnetic field-enhanced arc ion plating (AMFE-ARP) method, in which the interlayer of TiCu was first introduced for Cu-containing TiN film in order to improve comprehensive properties, especially the corrosion resistance of the film. The performance of the TiCu/TiCuN multilayer films was compared with that of the two single layers, TiN and TiCuN, which were deposited by the same method and the same total deposition time. The results indicated that the TiCu/TiCuN multilayer film of M2 revealed the best comprehensive corrosion resistance with low electric current values, high pitting potential, and high polarization resistance due to the proper thickness of TiCu interlayers and larger number of TiCu/TiCuN bilayers. In addition, the TiCu/TiCuN multilayer film of M2 also possesses comparable mechanical properties, excellent antibacterial and antibiofilm abilities, as well as good biocompatibility. Consequently, the antibacterial TiCu/TiCuN multilayer films with good corrosion resistance deposited by using the axial magnetic field-enhanced arc ion plating (AMFE-ARP) method are promising for application in biomedical antibacterial film for implants.
为了开发一种具有良好耐腐蚀性、优异机械性能和低细胞毒性的新型含铜抗菌 TiN 膜，采用轴向磁场增强电弧离子镀（AMFE-ARP）方法在 316L 不锈钢表面沉积了三种不同设计的 TiCu/TiCuN 多层（M1、M2、M3）膜，其中首先引入了 TiCu 中间层以提高含铜 TiN 膜的综合性能，特别是膜的耐腐蚀性。将 TiCu/TiCuN 多层膜的性能与通过相同方法和相同总沉积时间沉积的两种单层 TiN 和 TiCuN 进行了比较。结果表明，由于 TiCu 中间层的适当厚度和较大数量的 TiCu/TiCuN 双层，M2 中的 TiCu/TiCuN 多层膜具有最佳的综合耐腐蚀性，表现为低电流值、高钝电位和高极化电阻。此外，M2 的 TiCu/TiCuN 多层膜还具有相当的机械性能、优异的抗菌和抗生物膜能力以及良好的生物相容性。因此，采用轴向磁场增强电弧离子镀（AMFE-ARP）方法沉积的具有良好耐腐蚀性的抗菌 TiCu/TiCuN 多层膜有望应用于植入物的医用抗菌膜。
