Wu Peng, Ameen Tarek, Zhang Huairuo, Bendersky Leonid A, Ilatikhameneh Hesameddin, Klimeck Gerhard, Rahman Rajib, Davydov Albert V, Appenzeller Joerg
Materials Science and Engineering Division , National Institute of Standards and Technology (NIST) , Gaithersburg , Maryland 20899 , United States.
Theiss Research, Inc. , La Jolla , California 92037 , United States.
ACS Nano. 2019 Jan 22;13(1):377-385. doi: 10.1021/acsnano.8b06441. Epub 2018 Dec 21.
Band-to-band tunneling field-effect transistors (TFETs) have emerged as promising candidates for low-power integration circuits beyond conventional metal-oxide-semiconductor field-effect transistors (MOSFETs) and have been demonstrated to overcome the thermionic limit, which results intrinsically in sub-threshold swings of at least 60 mV/dec at room temperature. Here, we demonstrate complementary TFETs based on few-layer black phosphorus, in which multiple top gates create electrostatic doping in the source and drain regions. By electrically tuning the doping types and levels in the source and drain regions, the device can be reconfigured to allow for TFET or MOSFET operation and can be tuned to be n-type or p-type. Owing to the proper choice of materials and careful engineering of device structures, record-high current densities have been achieved in 2D TFETs. Full-band atomistic quantum transport simulations of the fabricated devices agree quantitatively with the current-voltage measurements, which gives credibility to the promising simulation results of ultrascaled phosphorene TFETs. Using atomistic simulations, we project substantial improvements in the performance of the fabricated TFETs when channel thicknesses and oxide thicknesses are scaled down.
带间隧穿场效应晶体管(TFET)已成为超越传统金属氧化物半导体场效应晶体管(MOSFET)的低功耗集成电路的有前途的候选者,并已被证明能够克服热电子极限,而热电子极限在室温下会导致本征亚阈值摆幅至少为60 mV/十倍频程。在此,我们展示了基于几层黑磷的互补TFET,其中多个顶栅在源极和漏极区域产生静电掺杂。通过电调谐源极和漏极区域的掺杂类型和水平,该器件可以重新配置以实现TFET或MOSFET操作,并且可以调谐为n型或p型。由于材料的恰当选择和器件结构的精心设计,二维TFET实现了创纪录的高电流密度。对所制备器件的全带原子量子输运模拟与电流-电压测量结果在数量上一致,这为超缩放磷烯TFET的有前景的模拟结果提供了可信度。使用原子模拟,我们预测当沟道厚度和氧化物厚度缩小时,所制备的TFET的性能将有显著改善。