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冷轧及低温轧制铜的位错密度与抗菌活性之间的关系

Relationship between Dislocation Density and Antibacterial Activity of Cryo-Rolled and Cold-Rolled Copper.

作者信息

Parmar Vinod, Changela Kandarp, Srinivas B, Mani Sankar Manimuthu, Mohanty Sujata, Panigrahi S K, Hariharan K, Kalyanasundaram Dinesh

机构信息

Centre for Biomedical Engineering, Indian Institute of Technology Delhi, New Delhi 110016, India.

Department of Physics, Indian Institute of Technology Delhi, New Delhi 110016, India.

出版信息

Materials (Basel). 2019 Jan 9;12(2):200. doi: 10.3390/ma12020200.

Abstract

In the present work, cold rolling and cryo-rolling were performed on 99% commercially pure copper substrates. Both cold and cryo-rolling processes caused severe plastic deformation that led to an increase in dislocation density by 14× and 28× respectively, as compared to the pristine material. Increases in average tensile strengths, by 75% (488 MPa) and 150% (698 MPa), were observed in the two rolled materials as the result of the enhancement in dislocation density. In addition to strength, enhanced antibacterial property of cryo-rolled copper was observed in comparison to cold rolled and pristine copper. Initial adhesion and subsequent proliferation of bio-film forming Gram-positive bacteria was reduced by 66% and 100% respectively for cryo-rolled copper. Approximately 55% protein leakage, as well as ethidium bromide (EtBr) uptake, were observed confirming rupture of cell membrane of Inductively coupled plasma-mass spectroscopy reveals higher leaching of elemental copper in nutrient broth media from the cryo-rolled copper. Detailed investigations showed that increased dislocation led to leaching of copper ions that caused damage to the bacterial cell wall and consequently killing of bacterial cells. Cryo-rolling enhanced both strength, as well as antibacterial activity, due to the presence of dislocations.

摘要

在本工作中,对99%的商业纯铜基板进行了冷轧和低温轧制。与原始材料相比,冷轧和低温轧制过程均导致严重的塑性变形,位错密度分别增加了14倍和28倍。由于位错密度的提高,在两种轧制材料中观察到平均抗拉强度分别提高了75%(488MPa)和150%(698MPa)。除了强度外,与冷轧铜和原始铜相比,低温轧制铜的抗菌性能增强。对于低温轧制铜,生物膜形成革兰氏阳性菌的初始粘附和随后的增殖分别降低了66%和100%。观察到约55%的蛋白质泄漏以及溴化乙锭(EtBr)摄取,证实了细胞膜破裂。电感耦合等离子体质谱显示,低温轧制铜在营养肉汤培养基中元素铜的浸出率更高。详细研究表明,位错增加导致铜离子浸出,从而对细菌细胞壁造成损伤,进而杀死细菌细胞。由于位错的存在,低温轧制提高了强度以及抗菌活性。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/62f9/6356488/229db6c5fa29/materials-12-00200-g001.jpg

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