Department of Printed Electronics Engineering, Sunchon National University, Suncheon, Jeonnam 57922, South Korea.
Nanoscale. 2019 Apr 4;11(14):6727-6736. doi: 10.1039/c9nr01011d.
The use of next-generation graphene requires the control of the number of deposition layers together with its fast synthesis for its use in advanced and miniaturized devices. Here, this article describes a novel technique for the selective growth of a continuous film of a graphene pattern (controlled monolayer/multilayer design) by the chemical vapor deposition (CVD) method on Cu foils modified by different plasma treatments. Ex situ Ar plasma treatment is the preferred treatment for monolayer graphene (I2D/IG = 1.81) synthesis. Bilayer graphene (I2D/IG = 1.05) growth was influenced by applying an additional oxygen plasma treatment, which led to different morphologies and control of the surface-active nature of Cu. The required design was achieved by a photolithography process. Graphene synthesis was performed by a short annealing process (60 s) followed by a single-step short burst of graphene growth (60 s). Relatively high density graphene nuclei with faster graphene growth resulted in monolayer graphene in the Ar plasma-treated area. Ex situ oxygen plasma treatment in selected areas was capable of controlling the amount of graphene nuclei formation, while the kink structure was capable of bolstering the adsorption of a relatively high amount of carbon adatoms, resulting in bilayer graphene.
下一代石墨烯的应用需要控制沉积层的数量,并快速合成,以便将其用于先进和小型化设备中。本文介绍了一种通过化学气相沉积(CVD)方法在经过不同等离子体处理的 Cu 箔上选择性生长石墨烯图案(控制单层/多层设计)连续薄膜的新技术。在用于合成单层石墨烯(I2D/IG = 1.81)时,优先采用 Ar 等离子体处理。通过施加额外的氧等离子体处理来影响双层石墨烯(I2D/IG = 1.05)的生长,这导致了 Cu 表面活性的不同形态和控制。所需的设计是通过光刻工艺实现的。通过短退火过程(60 s)进行石墨烯合成,然后进行单步短暂的石墨烯生长(60 s)。在 Ar 等离子体处理区域中,具有较高密度的石墨烯核和较快的石墨烯生长导致形成单层石墨烯。在选定区域进行的外源性氧等离子体处理能够控制石墨烯核形成的数量,而扭结结构能够增强相对大量的碳吸附原子的吸附,从而形成双层石墨烯。