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用于高性能聚酰亚胺薄膜的刚性与柔性混合组件设计

Mixed Rigid and Flexible Component Design for High-Performance Polyimide Films.

作者信息

Yu Xiaohui, Liang Weihua, Cao Jianhua, Wu Dayong

机构信息

Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China.

出版信息

Polymers (Basel). 2017 Sep 15;9(9):451. doi: 10.3390/polym9090451.

DOI:10.3390/polym9090451
PMID:30965753
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC6418812/
Abstract

To develop the polyimide (PI) which is closely matched to the coefficient of the thermal expansion (CTE) of copper, a series of PIs are prepared from 5,4'-diamino-2-phenyl benzimidazole (DAPBI), 4,4'-diaminodiphenyl ether (ODA), and 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) using a sequential copolymerization, blade coating, and thermal imidization process. The physical properties of the PIs are effectively regulated and optimized by adjusting the ratio of the rigid DAPBI and flexible ODA components. By increasing the DAPBI content, thermal stability, dimensional stability, and mechanical properties, the resultant polymer is enhanced. PI-80 exhibits an excellent comprehensive performance, a glass transition temperature of 370 °C, and a tensile strength of 210 MPa. Furthermore, the CTE as calculated in the range 50⁻250 °C is ca. 19 ppm/K, which is equal to that of copper. A highly dimensionally stable, curl-free, and high T-style peel strength (6.4 N/cm) of copper/PI laminate was obtained by casting the polyamic acid onto copper foil (13 μm) and thermally curing at 360 °C, which indicates that it has the potential to be applied as an electronic film for flexible displays and flexible printed circuit boards. A structural rationalization for these remarkable properties is also presented.

摘要

为了开发与铜的热膨胀系数（CTE）紧密匹配的聚酰亚胺（PI），通过顺序共聚、刮刀涂布和热亚胺化工艺，由5,4'-二氨基-2-苯基苯并咪唑（DAPBI）、4,4'-二氨基二苯醚（ODA）和3,3',4,4'-二苯甲酮四羧酸二酐（BTDA）制备了一系列聚酰亚胺。通过调整刚性DAPBI和柔性ODA组分的比例，有效地调节和优化了聚酰亚胺的物理性能。通过增加DAPBI含量，所得聚合物的热稳定性、尺寸稳定性和机械性能得到增强。PI-80表现出优异的综合性能，玻璃化转变温度为370℃，拉伸强度为210MPa。此外，在50⁻250℃范围内计算的CTE约为19ppm/K，与铜的CTE相等。通过将聚酰胺酸浇铸到铜箔（13μm）上并在360℃下热固化，获得了具有高度尺寸稳定性、无卷曲且具有高T型剥离强度（6.4N/cm）的铜/PI层压板，这表明它有潜力用作柔性显示器和柔性印刷电路板的电子薄膜。还提出了这些显著性能的结构合理化解释。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8ac9/6418812/25cdfc39f89a/polymers-09-00451-g017.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8ac9/6418812/25cdfc39f89a/polymers-09-00451-g017.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8ac9/6418812/460d2e1e134f/polymers-09-00451-sch001a.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8ac9/6418812/e00d5114d20b/polymers-09-00451-g012.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8ac9/6418812/ca2abd00ad60/polymers-09-00451-g015.jpg
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ACS Appl Mater Interfaces. 2016 Oct 5;8(39):26352-26358. doi: 10.1021/acsami.6b09383. Epub 2016 Sep 23.
提高用于先进电子应用的自支撑聚酰亚胺薄膜的韧性：关于成膜工艺影响的研究
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4
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Nanomaterials (Basel). 2023 Feb 8;13(4):656. doi: 10.3390/nano13040656.
5
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RSC Adv. 2021 May 7;11(28):16924-16930. doi: 10.1039/d1ra02218k. eCollection 2021 May 6.
6
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