Qian Guangtao, Hu Mengjie, Zhang Shangying, Wang Mengxia, Chen Chunhai, Yao Jianan
Center for Advanced Low-Dimension Materials, State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Material Science and Engineering, Donghua University, Shanghai 201620, China.
Polymers (Basel). 2020 Feb 13;12(2):442. doi: 10.3390/polym12020442.
To achieve polyimide-metal complexes with enhanced properties, 5-amine-2-(5-aminopyridin-2-yl)-1-methyl-benzimidazole (PyMePABZ) that contains stiff 2-(2'-pyridyl)benzimidazole (PyBI) was synthesized and exploited to construct the Cu(ΙΙ)-crosslinked polyimides (Cu-PIs). These Cu-PIs exhibited higher dielectric, thermal, and mechanical properties with an increase in Cu content. Among them, their dielectric constants (ε) were up to 43% superior to that of the neat PI, glass transition temperatures (Ts) were all over 400 °C, and 5% weight loss temperature (T) maintained beyond 500 °C. These data indicate that the metal coordination crosslinking provided a useful guide to develop high performance PIs which possess potential application as useful high temperature capacitors.
为了获得具有增强性能的聚酰亚胺-金属配合物，合成了含有刚性2-(2'-吡啶基)苯并咪唑(PyBI)的5-氨基-2-(5-氨基吡啶-2-基)-1-甲基苯并咪唑(PyMePABZ)，并用于构建铜(Ⅱ)交联聚酰亚胺(Cu-PIs)。随着铜含量的增加，这些Cu-PIs表现出更高的介电、热和机械性能。其中，它们的介电常数(ε)比纯PI高出43%，玻璃化转变温度(Ts)均超过400℃，5%失重温度(T)保持在500℃以上。这些数据表明，金属配位交联为开发具有潜在应用价值的高温电容器的高性能聚酰亚胺提供了有用的指导。
