Kim Dong Chan, Shim Hyung Joon, Lee Woongchan, Koo Ja Hoon, Kim Dae-Hyeong
Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul, 08826, Republic of Korea.
School of Chemical and Biological Engineering and Institute of Chemical Processes, Seoul National University, Seoul, 08826, Republic of Korea.
Adv Mater. 2020 Apr;32(15):e1902743. doi: 10.1002/adma.201902743. Epub 2019 Aug 13.
Stretchable electronics are mechanically compatible with a variety of objects, especially with the soft curvilinear contours of the human body, enabling human-friendly electronics applications that could not be achieved with conventional rigid electronics. Therefore, extensive research effort has been devoted to the development of stretchable electronics, from research on materials and unit device, to fully integrated systems. In particular, material-processing technologies that encompass the synthesis, assembly, and patterning of intrinsically stretchable electronic materials have been actively investigated and have provided many notable breakthroughs for the advancement of stretchable electronics. Here, the latest studies of such material-based approaches are reviewed, mainly focusing on intrinsically stretchable electronic nanocomposites that generally consist of conducting/semiconducting filler materials inside or on elastomer backbone matrices. Various approaches for fabricating these intrinsically stretchable electronic materials are presented, including the blending of electronic fillers into elastomer matrices, the formation of bi-layered heterogeneous electronic-layer and elastomer support-layer structures, and modifications to polymeric molecular structures in order to impart stretchability. Detailed descriptions of the various conducting/semiconducting composites prepared by each method are provided, along with their electrical/mechanical properties and examples of device applications. To conclude, a brief future outlook is presented.
可拉伸电子器件在机械性能上与各种物体兼容，尤其是与人体柔软的曲线轮廓兼容，从而实现了传统刚性电子器件无法实现的人性化电子应用。因此，从材料和单元器件的研究到完全集成系统，人们在可拉伸电子器件的开发上投入了大量的研究精力。特别是，涵盖本征可拉伸电子材料的合成、组装和图案化的材料加工技术已得到积极研究，并为可拉伸电子器件的发展提供了许多显著突破。在此，对这类基于材料的方法的最新研究进行综述，主要关注本征可拉伸电子纳米复合材料，其通常由弹性体主链基质内部或之上的导电/半导体填充材料组成。介绍了制备这些本征可拉伸电子材料的各种方法，包括将电子填料混入弹性体基质、形成双层异质电子层和弹性体支撑层结构，以及对聚合物分子结构进行改性以赋予其拉伸性。提供了通过每种方法制备的各种导电/半导体复合材料的详细描述，以及它们的电学/力学性能和器件应用实例。最后，给出了简要的未来展望。
