Gablech Imrich, Klempa Jaroslav, Pekárek Jan, Vyroubal Petr, Hrabina Jan, Holá Miroslava, Kunz Jan, Brodský Jan, Neužil Pavel
Central European Institute of Technology, Brno University of Technology, CZ-61600 Brno, Czech Republic.
Department of Microelectronics, Faculty of Electrical Engineering and Communication, Brno University of Technology, CZ-61600 Brno, Czech Republic.
Micromachines (Basel). 2020 Jan 28;11(2):143. doi: 10.3390/mi11020143.
In this work, we demonstrate the simple fabrication process of AlN-based piezoelectric energy harvesters (PEH), which are made of cantilevers consisting of a multilayer ion beam-assisted deposition. The preferentially (001) orientated AlN thin films possess exceptionally high piezoelectric coefficients of (7.33 ± 0.08) pC∙N. The fabrication of PEH was completed using just three lithography steps, conventional silicon substrate with full control of the cantilever thickness, in addition to the thickness of the proof mass. As the AlN deposition was conducted at a temperature of ≈330 °C, the process can be implemented into standard complementary metal oxide semiconductor (CMOS) technology, as well as the CMOS wafer post-processing. The PEH cantilever deflection and efficiency were characterized using both laser interferometry, and a vibration shaker, respectively. This technology could become a core feature for future CMOS-based energy harvesters.
在这项工作中,我们展示了基于氮化铝(AlN)的压电能量采集器(PEH)的简单制造工艺,该采集器由多层离子束辅助沉积的悬臂梁构成。择优取向为(001)的AlN薄膜具有异常高的压电系数,为(7.33±0.08)pC∙N。PEH的制造仅通过三个光刻步骤即可完成,使用传统的硅衬底,并能完全控制悬臂梁的厚度以及验证质量的厚度。由于AlN沉积是在约330°C的温度下进行的,该工艺既可以应用于标准互补金属氧化物半导体(CMOS)技术,也可以用于CMOS晶圆后处理。分别使用激光干涉测量法和振动台对PEH悬臂梁的挠度和效率进行了表征。这项技术可能会成为未来基于CMOS的能量采集器的核心特性。