用于凸点下金属化中扩散阻挡层的脉冲电镀 Ni-W 合金。

Pulse Electroplating of Ni-W Alloy for the Diffusion Barrier in Under Bump Metallurgy.

机构信息

Department of Materials Science and Engineering, Hongik University, 94 Wausan-ro, Mapo-gu, Seoul 04066, Korea.

出版信息

J Nanosci Nanotechnol. 2021 May 1;21(5):3016-3019. doi: 10.1166/jnn.2021.19137.

DOI:10.1166/jnn.2021.19137

Abstract

Ni-W alloy was electroplated from citrate bath. The crack-free coatings were obtained using the pulse electroplating method. The surface hardness was increased up to 700 H and it is twice as high than that of the electroplated Ni. The surface hardness was increased as the content of W in the coating increased. However, the higher W contents made surface cracks and the surface hardness was decreased. Ni-W alloy made less intermetallic components (IMC) and the shear force of solder ball was increased as much as 20% compared with conventional Ni plating.

摘要

从柠檬酸盐镀液中电镀 Ni-W 合金。采用脉冲电镀法获得无裂纹的涂层。表面硬度提高到 700 H，是电镀 Ni 的两倍。随着涂层中 W 含量的增加，表面硬度也随之增加。然而，较高的 W 含量会导致表面出现裂纹，从而降低表面硬度。Ni-W 合金生成的金属间化合物（IMC）较少，与传统的 Ni 电镀相比，焊点的剪切力增加了 20%。