Kameyama Nobukazu, Yoshida Hiroki, Fukagawa Hitoshi, Yamada Kotaro, Fukuda Mitsutaka
Department of Electrical, Electronic and Computer Engineering, Faculty of Engineering, Gifu University, 1-1 Yanagito, Gifu City 501-1193, Japan.
Institute for Advanced Technology, Heiwadori, Seki City 501-3874, Japan.
Polymers (Basel). 2021 Apr 30;13(9):1448. doi: 10.3390/polym13091448.
Carbon dioxide (CO) laser is widely used in commercial and industrial fields to process various materials including polymers, most of which have high absorptivity in infrared spectrum. Thin-film processing by the continuous wave (CW) laser is difficult since polymers are deformed and damaged by the residual heat. We developed the new method to make polypropylene (PP) and polystyrene (PS) sheets thin. The sheets are pressed to a Cu base by extracting air between the sheets and the base during laser processing. It realizes to cut the sheets to around 50 µm thick with less heat effects on the backside which are inevitable for thermal processing using the CW laser. It is considered that the boundary between the sheets and the base is in thermal equilibrium and the base prevents the sheets from deforming to support the backside. The method is applicable to practical use since it does not need any complex controls and is easy to install to an existing equipment with a minor change of the stage.
二氧化碳(CO)激光广泛应用于商业和工业领域,用于加工包括聚合物在内的各种材料,其中大多数在红外光谱中具有高吸收率。由于聚合物会因残余热量而变形和损坏,因此用连续波(CW)激光进行薄膜加工很困难。我们开发了一种使聚丙烯(PP)和聚苯乙烯(PS)片材变薄的新方法。在激光加工过程中,通过抽出片材与基底之间的空气,将片材压在铜基底上。它能够将片材切割至约50微米厚,同时对背面的热影响较小,而这对于使用连续波激光的热处理来说是不可避免的。据认为,片材与基底之间的边界处于热平衡状态,基底可防止片材变形,从而支撑背面。该方法无需任何复杂控制,易于安装到现有设备上,只需对工作台稍作改动,即可实际应用。