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具有分裂异质结栅极的4H-SiC双沟槽MOSFET以改善开关特性。

4H-SiC Double Trench MOSFET with Split Heterojunction Gate for Improving Switching Characteristics.

作者信息

Na Jaeyeop, Cheon Jinhee, Kim Kwangsoo

机构信息

Department of Electronic Engineering, Sogang University, Seoul 04107, Korea.

出版信息

Materials (Basel). 2021 Jun 25;14(13):3554. doi: 10.3390/ma14133554.

DOI:10.3390/ma14133554
PMID:34202093
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC8269547/
Abstract

In this paper, a novel 4H-SiC split heterojunction gate double trench metal-oxide-semiconductor field-effect transistor (SHG-DTMOS) is proposed to improve switching speed and loss. The device modifies the split gate double trench MOSFET (SG-DTMOS) by changing the N polysilicon split gate to the P polysilicon split gate. It has two separate P shielding regions under the gate to use the P split polysilicon gate as a heterojunction body diode and prevent reverse leakage `current. The static and most dynamic characteristics of the SHG-DTMOS are almost like those of the SG-DTMOS. However, the reverse recovery charge is improved by 65.83% and 73.45%, and the switching loss is improved by 54.84% and 44.98%, respectively, compared with the conventional double trench MOSFET (Con-DTMOS) and SG-DTMOS owing to the heterojunction.

摘要

本文提出了一种新型的4H-SiC分裂异质结栅极双沟槽金属氧化物半导体场效应晶体管(SHG-DTMOS),以提高开关速度并降低损耗。该器件通过将N型多晶硅分裂栅极改为P型多晶硅分裂栅极来改进分裂栅极双沟槽MOSFET(SG-DTMOS)。它在栅极下方有两个独立的P屏蔽区域,将P型分裂多晶硅栅极用作异质结体二极管并防止反向漏电流。SHG-DTMOS的静态和大多数动态特性几乎与SG-DTMOS相同。然而,由于异质结的作用,与传统双沟槽MOSFET(Con-DTMOS)和SG-DTMOS相比,反向恢复电荷分别提高了65.83%和73.45%,开关损耗分别提高了54.84%和44.98%。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/2edc07a0fa95/materials-14-03554-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/546b1602c376/materials-14-03554-g001.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/5a41b56f7cf8/materials-14-03554-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/b4344d132d86/materials-14-03554-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/f1cee4864eb7/materials-14-03554-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/2edc07a0fa95/materials-14-03554-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/546b1602c376/materials-14-03554-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/7e356a0a8852/materials-14-03554-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/415c4230f6be/materials-14-03554-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/0ffe22a6ba3e/materials-14-03554-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/6450432e5cdc/materials-14-03554-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/32f50c2b5ba5/materials-14-03554-g006a.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/5a41b56f7cf8/materials-14-03554-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/b4344d132d86/materials-14-03554-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/f1cee4864eb7/materials-14-03554-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f025/8269547/2edc07a0fa95/materials-14-03554-g010.jpg

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Vertical and bevel-structured SiC etching techniques incorporating different gas mixture plasmas for various microelectronic applications.采用不同混合气体等离子体的垂直和斜面结构化碳化硅刻蚀技术,适用于各种微电子应用。
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