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电子纺织品的微电子集成综述。

Review on the Integration of Microelectronics for E-Textile.

作者信息

Simegnaw Abdella Ahmmed, Malengier Benny, Rotich Gideon, Tadesse Melkie Getnet, Van Langenhove Lieva

机构信息

Department of Materials, Textiles and Chemical Engineering, Ghent University, 9000 Gent, Belgium.

Ethiopian Institute of Textile and Fashion Technologies, Bahir Dar University, Bahir Dar 6000, Ethiopia.

出版信息

Materials (Basel). 2021 Sep 6;14(17):5113. doi: 10.3390/ma14175113.

DOI:10.3390/ma14175113
PMID:34501200
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC8434590/
Abstract

Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical, and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable, and washable to offer a superior usability, comfortability, and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile-adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

摘要

现代电子纺织品正朝着柔性可穿戴纺织品发展，即所谓的电子织物，其在纺织面料上嵌入了微电子元件，可用于各类功能。将刚性微电子元件集成到纺织品中或纺织品上以开发智能纺织品有不同的方法，包括但不限于物理、机械和化学方法。集成系统必须具备柔性、轻质、可拉伸和可洗涤的特性，以提供卓越的可用性、舒适性和非侵入性。此外，制成的可穿戴服装还需要透气。在这项综述工作中，讨论了微电子元件与纺织结构集成的三个层次，即适应纺织品的、集成到纺织品中的和基于纺织品的集成。集成到纺织品中的和适应纺织品的电子织物未能有效满足柔性和可洗涤的要求。为克服上述问题，研究人员通过应用各种机制，研究了在纤维或纱线层面将微电子元件集成到纺织品中或纺织品上的方法。因此，一种新的集成方法——基于纺织品的集成，因其最终产品具有柔性和可洗涤的优点而应运而生。总的来说，本综述的目的是全面概述将电子元件集成到纺织基材中或纺织基材上的不同互连方法。

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