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创纪录高性能氢化铟镓锌氧化物柔性肖特基二极管

Record-High-Performance Hydrogenated In-Ga-Zn-O Flexible Schottky Diodes.

作者信息

Magari Yusaku, Aman S G Mehadi, Koretomo Daichi, Masuda Kentaro, Shimpo Kenta, Makino Hisao, Kimura Mutsumi, Furuta Mamoru

机构信息

School of Environmental Science and Engineering, Kochi University of Technology, Kami, Kochi 782-8502, Japan.

Center for Nanotechnology, Research Institute, Kochi University of Technology, Kami, Kochi 782-8502, Japan.

出版信息

ACS Appl Mater Interfaces. 2020 Oct 21;12(42):47739-47746. doi: 10.1021/acsami.0c12638. Epub 2020 Oct 13.

Abstract

High-performance In-Ga-Zn-O (IGZO) Schottky diodes (SDs) were fabricated using hydrogenated IGZO (IGZO:H) at a maximum process temperature of 150 °C. IGZO:H was prepared by Ar + O + H sputtering. IGZO:H SDs on a glass substrate exhibited superior electrical properties with a very high rectification ratio of 3.8 × 10, an extremely large Schottky barrier height of 1.17 eV, and a low ideality factor of 1.07. It was confirmed that the hydrogen incorporated during IGZO:H deposition increased the band gap energy from 3.02 eV (IGZO) to 3.29 eV (IGZO:H). Thus, it was considered that the increase in band gap energy (decrease in electron affinity) of IGZO:H contributed to the increase in the Schottky barrier height of the SDs. Angle-resolved hard X-ray photoelectron spectroscopy analysis revealed that oxygen vacancies in IGZO:H were much fewer than those in IGZO, especially in the region near the film surface. Moreover, it was found that the density of near-conduction band minimum states in IGZO:H was lower than that in IGZO. Therefore, IGZO:H played a key role in improving the Schottky interface quality, namely, the increase of Schottky barrier height, decrease of oxygen vacancies, and reduction of near-conduction band minimum states. Finally, we fabricated a flexible IGZO:H SD on a poly(ethylene naphthalate) substrate, and it exhibited record electrical properties with a rectification ratio of 1.7 × 10, Schottky barrier height of 1.12 eV, and ideality factor of 1.10. To the best of our knowledge, both the IGZO:H SDs formed on glass and poly(ethylene naphthalate) substrates achieved the best performance among the IGZO SDs reported to date. The proposed method successfully demonstrated great potential for future flexible electronic applications.

摘要

采用氢化铟镓锌氧化物(IGZO:H)在最高工艺温度为150°C的条件下制备了高性能的铟镓锌氧化物(IGZO)肖特基二极管(SDs)。IGZO:H通过氩气+氧气+氢气溅射制备。玻璃衬底上的IGZO:H SDs表现出优异的电学性能,具有3.8×10的非常高的整流比、1.17 eV的极大肖特基势垒高度和1.07的低理想因子。证实了在IGZO:H沉积过程中掺入的氢使带隙能量从3.02 eV(IGZO)增加到3.29 eV(IGZO:H)。因此,认为IGZO:H带隙能量的增加(电子亲和能的降低)有助于SDs肖特基势垒高度的增加。角分辨硬X射线光电子能谱分析表明,IGZO:H中的氧空位比IGZO中的少得多,特别是在薄膜表面附近区域。此外,发现IGZO:H中近导带最小值态的密度低于IGZO中的。因此,IGZO:H在改善肖特基界面质量方面起着关键作用,即肖特基势垒高度的增加、氧空位的减少和近导带最小值态的降低。最后,我们在聚萘二甲酸乙二酯衬底上制备了柔性IGZO:H SD,其表现出创纪录的电学性能,整流比为1.7×10,肖特基势垒高度为1.12 eV,理想因子为1.10。据我们所知,在玻璃和聚萘二甲酸乙二酯衬底上形成的IGZO:H SDs在迄今为止报道的IGZO SDs中均实现了最佳性能。所提出的方法成功地展示了在未来柔性电子应用中的巨大潜力。

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