Wang Zhuo, Fan Jiahao, Guo Xu, Ji Jiamin, Sun Zixiong
School of Materials Science and Engineering, Shaanxi Key Laboratory of Green Preparation and Functionalization for Inorganic Materials, Shaanxi University of Science and Technology Xi'an 710021 People's Republic of China
School of Electrical Informatica and Artificial Intelligence, Shaanxi University of Science and Technology Xi'an 710021 People's Republic of China.
RSC Adv. 2020 Jul 20;10(45):27025-27032. doi: 10.1039/d0ra03493b. eCollection 2020 Jul 15.
Polymer matrix composites are expected to promote the development of embedded packaging technology for circuit boards, but it is still impossible to obtain polymer matrix composites with high permittivity and low loss tangent simultaneously. In this study, a laminated composite with a middle-layer possessing negative permittivity effects was prepared by hot pressing sintering using MAX phase ceramics as a conductive filler. High permittivity (170@1 kHz) and low loss tangent (0.3@1 kHz) were achieved in traditional sandwich polymer matrix composites (SPMCs). Its high permittivity can be explained by the series capacitor model and the interfacial polarization promoted by the flake structure of the MAX phase ceramics. Low loss tangent is guaranteed by the ohmic barrier effect caused by the huge resistance difference between adjacent layers in the composite material. These SPMCs with special structure are expected to provide new ideas for developing embedded capacitors.
聚合物基复合材料有望推动电路板嵌入式封装技术的发展，但目前仍无法同时获得高介电常数和低损耗角正切的聚合物基复合材料。在本研究中，以MAX相陶瓷为导电填料，通过热压烧结制备了一种中间层具有负介电常数效应的层压复合材料。在传统的三明治聚合物基复合材料（SPMC）中实现了高介电常数（170@1kHz）和低损耗角正切（0.3@1kHz）。其高介电常数可以通过串联电容器模型以及MAX相陶瓷片状结构促进的界面极化来解释。低损耗角正切则由复合材料中相邻层之间巨大的电阻差异所引起的欧姆势垒效应来保证。这些具有特殊结构的SPMC有望为开发嵌入式电容器提供新思路。
