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铜通过石墨烯的氧化动力学及其对石墨烯电学性质的影响。

Cu oxidation kinetics through graphene and its effect on the electrical properties of graphene.

作者信息

Kim Min-Sik, Kim Ki-Ju, Kim Minsu, Lee Sangbong, Lee Kyu Hyun, Kim Hyeongkeun, Kim Hyun-Mi, Kim Ki-Bum

机构信息

Department of Materials Science and Engineering, Seoul National University 1 Gwanak-ro, Gwanak-gu Seoul 08826 South Korea.

Korea Electronics Technology Institute 25 Saenari-ro, Bundang-gu, Seongnam-si Gyeonggi-do 13509 South Korea.

出版信息

RSC Adv. 2020 Sep 28;10(59):35671-35680. doi: 10.1039/d0ra06301k.

Abstract

The oxidation kinetics of Cu through graphene were evaluated from the surface coverage of Cu oxide ( ) by varying the oxidation time ( = 10-360 min) and temperature ( = 180-240 °C) under an air environment. , as a function of time, well followed the Johnson-Mehl-Avrami-Kolmogorov equation; thus, the activation energy of Cu oxidation was estimated as 1.5 eV. Transmission electron microscopy studies revealed that CuO formed on the top of the graphene at grain boundaries (G-GBs), indicating that CuO growth was governed by the out-diffusion of Cu through G-GBs. Further, the effect of Cu oxidation on graphene quality was investigated by measuring the electrical properties of graphene after transferring. The variation of the sheet resistance ( ) as a function of at all was converted into one curve as a function of . of 250 Ω sq was constant, similar to that of as-grown graphene up to = 15%, and then increased with . The Hall measurement revealed that the carrier concentration remained constant in the entire range of , and was solely related to the decrease in the Hall mobility. The variation in Hall mobility was examined according to the graphene percolation probability model, simulating electrical conduction on G-GBs during CuO evolution. This model well explains the constant Hall mobility within = 15% and drastic degradation of 15-50% by the concept that the electrical conduction of graphene is disconnected by CuO formation along with the G-GBs. Therefore, we systematically developed the oxidation kinetics of Cu through graphene and simultaneously examined the changes in the electrical properties of graphene.

摘要

通过在空气环境中改变氧化时间(t = 10 - 360分钟)和温度(T = 180 - 240°C),根据氧化铜(CuO)的表面覆盖率评估了铜(Cu)通过石墨烯的氧化动力学。CuO的表面覆盖率随时间的变化很好地遵循了约翰逊 - 梅耳 - 阿夫拉米 - 科尔莫戈罗夫方程;因此,估计Cu氧化的活化能为1.5电子伏特。透射电子显微镜研究表明,CuO在石墨烯顶部的晶界(G - GBs)处形成,这表明CuO的生长受Cu通过G - GBs的向外扩散控制。此外,通过测量转移后石墨烯的电学性质,研究了Cu氧化对石墨烯质量的影响。在所有温度下,薄层电阻(Rs)随氧化时间(t)的变化被转换为一条随氧化程度(θ)变化的曲线。在氧化程度达到15%之前,Rs为250Ω/sq保持恒定,与生长态石墨烯相似,然后随氧化程度增加。霍尔测量表明,在整个氧化程度范围内载流子浓度保持恒定,并且Rs仅与霍尔迁移率的降低有关。根据石墨烯渗流概率模型研究了霍尔迁移率的变化,该模型模拟了CuO演化过程中G - GBs上的导电情况。该模型通过石墨烯的导电因沿G - GBs形成CuO而断开这一概念,很好地解释了氧化程度在15%以内时霍尔迁移率恒定以及氧化程度在15% - 50%时Rs急剧下降的现象。因此,我们系统地研究了Cu通过石墨烯的氧化动力学,并同时研究了石墨烯电学性质的变化。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d3c3/9056939/41792b7539fa/d0ra06301k-f1.jpg

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