Peng Kang-Wei, Tseng Ming-Chun, Lin Su-Hui, Lai Shouqiang, Shen Meng-Chun, Wuu Dong-Sing, Horng Ray-Hua, Chen Zhong, Wu Tingzhu
Opt Express. 2022 Dec 19;30(26):47792-47800. doi: 10.1364/OE.475219.
In this study, deep-ultraviolet light-emitting diodes (DUV LEDs) with different chip sidewall geometries (CSGs) are investigated. The structure had two types of chip sidewall designs that combined DUV LEDs with the same p-GaN thickness. By comparing the differences of the characteristics such as the external quantum efficiency droops, light output power, light extraction efficiency (LEE), and junction temperature of these DUV LEDs, the self-heated effect and light-tracing simulation results have been clearly demonstrated to explain the inclined sidewalls that provide more possibility pathway for photons escape to increase the LEE of LEDs; thus, the DUV LEDs with the CSG presented improved performance. These results demonstrate the potential of CSG for DUV LED applications.
在本研究中,对具有不同芯片侧壁几何形状(CSG)的深紫外发光二极管(DUV LED)进行了研究。该结构有两种芯片侧壁设计,它们将具有相同p-GaN厚度的DUV LED组合在一起。通过比较这些DUV LED的外部量子效率下降、光输出功率、光提取效率(LEE)和结温等特性的差异,清晰地展示了自热效应和光追踪模拟结果,以解释倾斜侧壁为光子逃逸提供了更多可能路径,从而提高了LED的LEE;因此,具有CSG的DUV LED表现出了更好的性能。这些结果证明了CSG在DUV LED应用中的潜力。