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用于电子应用的芳香族聚酰亚胺薄膜的进展

Progress in Aromatic Polyimide Films for Electronic Applications.

作者信息

Wu Ziyu, He Jianjun, Yang Haixia, Yang Shiyong

机构信息

Key Laboratory of Science and Technology on High-Tech Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China.

School of Chemical Sciences, University of Chinese Academy of Sciences, Beijing 100049, China.

出版信息

Polymers (Basel). 2022 Mar 21;14(6):1269. doi: 10.3390/polym14061269.

Abstract

Aromatic polyimides have excellent thermal stability, mechanical strength and toughness, high electric insulating properties, low dielectric constants and dissipation factors, and high radiation and wear resistance, among other properties, and can be processed into a variety of materials, including films, fibers, carbon fiber composites, engineering plastics, foams, porous membranes, coatings, etc. Aromatic polyimide materials have found widespread use in a variety of high-tech domains, including electric insulating, microelectronics and optoelectronics, aerospace and aviation industries, and so on, due to their superior combination characteristics and variable processability. In recent years, there have been many publications on aromatic polyimide materials, including several books available to readers. In this review, the representative progress in aromatic polyimide films for electronic applications, especially in our laboratory, will be described.

摘要

芳香族聚酰亚胺具有优异的热稳定性、机械强度和韧性、高电绝缘性能、低介电常数和损耗因子以及高辐射和耐磨性等特性,并且可以加工成多种材料,包括薄膜、纤维、碳纤维复合材料、工程塑料、泡沫、多孔膜、涂层等。由于其优异的综合性能和可变的加工性能,芳香族聚酰亚胺材料已在包括电绝缘、微电子和光电子、航空航天等在内的各种高科技领域得到广泛应用。近年来,关于芳香族聚酰亚胺材料有许多出版物,包括几本可供读者阅读的书籍。在本综述中,将描述用于电子应用的芳香族聚酰亚胺薄膜的代表性进展,特别是在我们实验室取得的进展。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2109/8951356/2a1542f52a84/polymers-14-01269-sch001.jpg

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