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温度变化对基于现场可编程门阵列的多通道时间数字转换器影响的研究

A Study on the Effect of Temperature Variations on FPGA-Based Multi-Channel Time-to-Digital Converters.

作者信息

Alshehry Awwad H, Alshahry Saleh M, Alhazmi Abdullah K, Chodavarapu Vamsy P

机构信息

Department of Electrical and Computer Engineering, University of Dayton, 300 College Park, Dayton, OH 45469, USA.

出版信息

Sensors (Basel). 2023 Sep 5;23(18):7672. doi: 10.3390/s23187672.

Abstract

We describe a study on the effect of temperature variations on multi-channel time-to-digital converters (TDCs). The objective is to study the impact of ambient thermal variations on the performance of field-programmable gate array (FPGA)-based tapped delay line (TDL) TDC systems while simultaneously meeting the requirements of high-precision time measurement, low-cost implementation, small size, and low power consumption. For our study, we chose two devices, Artix-7 and ProASIC3L, manufactured by Xilinx and Microsemi, respectively. The radiation-tolerant ProASIC3L device offers better stability in terms of thermal sensitivity and power consumption compared to the Artix-7. To assess the performance of the TDCs under varying thermal conditions, a laboratory thermal chamber was utilized to maintain ambient temperatures ranging from -75 to 80 °C. This analysis ensured a comprehensive evaluation of the TDCs' performance across a wide operational range. By utilizing the Artix-7 and ProASIC3L devices, we achieved root mean square (RMS) resolution of 24.7 and 554.59 picoseconds, respectively. Total on-chip power of 0.968 W was achieved using Artix-7, while 1.997 mW of power consumption was achieved using the ProASIC3L device. We worked to determine the temperature sensitivity for both FPGA devices, which could help in the design and optimization of FPGA-based TDCs for many applications.

摘要

我们描述了一项关于温度变化对多通道时间数字转换器(TDC)影响的研究。目的是研究环境热变化对基于现场可编程门阵列(FPGA)的抽头延迟线(TDL)TDC系统性能的影响,同时满足高精度时间测量、低成本实现、小尺寸和低功耗的要求。在我们的研究中,我们选择了分别由赛灵思(Xilinx)和美高森美(Microsemi)制造的两款器件,即Artix-7和ProASIC3L。与Artix-7相比,耐辐射的ProASIC3L器件在热灵敏度和功耗方面具有更好的稳定性。为了评估TDC在不同热条件下的性能,利用实验室热室将环境温度维持在-75至80°C范围内。该分析确保了在广泛的工作范围内对TDC性能进行全面评估。通过使用Artix-7和ProASIC3L器件,我们分别实现了24.7皮秒和554.59皮秒的均方根(RMS)分辨率。使用Artix-7时实现了0.968 W的片上总功耗,而使用ProASIC3L器件时实现了1.997 mW的功耗。我们致力于确定这两款FPGA器件的温度灵敏度,这有助于为许多应用设计和优化基于FPGA的TDC。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3ed7/10536187/c4a8df5dcce2/sensors-23-07672-g001.jpg

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