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具有优化材料去除率的碳化硅陶瓷的高功率飞秒激光加工

High-Power Femtosecond Laser Processing of SiC Ceramics with Optimized Material Removal Rate.

作者信息

Zhang Jian, Liu Zhichao, Zhang Yuanhang, Geng Feng, Wang Shengfei, Fan Fei, Zhang Qinghua, Xu Qiao

机构信息

Laser Fusion Research Center, China Academy of Engineering Physics, Mianyang 621900, China.

出版信息

Micromachines (Basel). 2023 Oct 21;14(10):1960. doi: 10.3390/mi14101960.

DOI:10.3390/mi14101960
PMID:37893397
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC10609315/
Abstract

Silicon carbide (SiC) ceramics are widely used as structural materials for various applications. However, the extraordinarily high hardness, brittleness, low material removal rate, and severe tool wear of these materials significantly impact the performance of conventional mechanical processing techniques. In this study, we investigated the influence of different parameters on the material removal rate, surface quality, and surface oxidation during the laser processing of SiC ceramic samples using a high-repetition-frequency femtosecond laser at a wavelength of 1030 nm. Additionally, an experimental investigation was conducted to analyze the effects of a burst mode on the material removal rate. Our results demonstrate that the surface oxidation, which significantly affects the material removal rate, can be effectively reduced by increasing the laser scanning speed and decreasing the laser scanning pitch. The material removal rate and surface quality are mainly affected by laser fluence. The optimal material removal rate is obtained with a laser fluence of 0.4 J/cm at a pulse width of 470 fs.

摘要

碳化硅（SiC）陶瓷作为结构材料被广泛应用于各种领域。然而，这些材料极高的硬度、脆性、低材料去除率以及严重的刀具磨损，显著影响了传统机械加工技术的性能。在本研究中，我们使用波长为1030 nm的高重复频率飞秒激光，研究了不同参数对SiC陶瓷样品激光加工过程中材料去除率、表面质量和表面氧化的影响。此外，还进行了一项实验研究，以分析脉冲模式对材料去除率的影响。我们的结果表明，通过提高激光扫描速度和减小激光扫描间距，可以有效降低对材料去除率有显著影响的表面氧化。材料去除率和表面质量主要受激光能量密度的影响。在脉冲宽度为470 fs时，激光能量密度为0.4 J/cm²可获得最佳材料去除率。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/e10d32754b58/micromachines-14-01960-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/e2c63bb1f15a/micromachines-14-01960-g001.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/5be81e80256a/micromachines-14-01960-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/497f7ad102a0/micromachines-14-01960-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/4eb1ac4a437b/micromachines-14-01960-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/5c1f200154e8/micromachines-14-01960-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/8eee100f4c2c/micromachines-14-01960-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/e4f7c037cd5e/micromachines-14-01960-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/6b16a4c67d59/micromachines-14-01960-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/768987190d0e/micromachines-14-01960-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/e10d32754b58/micromachines-14-01960-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/e2c63bb1f15a/micromachines-14-01960-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/c69d986d3c56/micromachines-14-01960-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/05871985e90c/micromachines-14-01960-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/5be81e80256a/micromachines-14-01960-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/497f7ad102a0/micromachines-14-01960-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/4eb1ac4a437b/micromachines-14-01960-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/5c1f200154e8/micromachines-14-01960-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/8eee100f4c2c/micromachines-14-01960-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/e4f7c037cd5e/micromachines-14-01960-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/6b16a4c67d59/micromachines-14-01960-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/768987190d0e/micromachines-14-01960-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bf8b/10609315/e10d32754b58/micromachines-14-01960-g012.jpg

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Micromachines (Basel). 2023 Aug 22;14(9):1650. doi: 10.3390/mi14091650.
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Laser-Based Manufacturing of Ceramics: A Review.基于激光的陶瓷制造：综述
Micromachines (Basel). 2023 Aug 6;14(8):1564. doi: 10.3390/mi14081564.
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Experimental Investigation on Ablation of 4H-SiC by Infrared Femtosecond Laser.红外飞秒激光烧蚀4H-SiC的实验研究
Micromachines (Basel). 2022 Aug 11;13(8):1291. doi: 10.3390/mi13081291.
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Influence of Pulse Energy and Defocus Amount on the Mechanism and Surface Characteristics of Femtosecond Laser Polishing of SiC Ceramics.脉冲能量和离焦量对SiC陶瓷飞秒激光抛光机理及表面特性的影响
Micromachines (Basel). 2022 Jul 15;13(7):1118. doi: 10.3390/mi13071118.
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Percussion drilling in glasses and process dynamics with femtosecond laser GHz-bursts.利用飞秒激光千兆赫脉冲串对玻璃进行冲击钻孔及过程动力学研究。
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