Sporer Markus, Vasilas Ioana-Georgiana, Adzemovic Ahmed, Graber Nicolas, Reich Stefan, Gueli Calogero, Eickenscheidt Max, Diester Ilka, Stieglitz Thomas, Ortmanns Maurits
IEEE Trans Biomed Circuits Syst. 2024 Apr;18(2):247-262. doi: 10.1109/TBCAS.2024.3354785. Epub 2024 Apr 1.
This article presents the system architecture for an implant concept called NeuroBus. Tiny distributed direct digitizing neural recorder ASICs on an ultra-flexible polyimide substrate are connected in a bus-like structure, allowing short connections between electrode and recording front-end with low wiring effort and high customizability. The small size (344 μm × 294 μm) of the ASICs and the ultraflexible substrate allow a low bending stiffness, enabling the implant to adapt to the curvature of the brain and achieving high structural biocompatibility. We introduce the architecture, the integrated building blocks, and the post-CMOS processes required to realize a NeuroBus, and we characterize the prototyped direct digitizing neural recorder front-end as well as polyimide-based ECoG brain interface. A rodent animal model is further used to validate the joint capability of the recording front-end and thin-film electrode array.
本文介绍了一种名为NeuroBus的植入式概念系统架构。超柔性聚酰亚胺基板上的微型分布式直接数字化神经记录专用集成电路(ASIC)以类似总线的结构连接,使得电极与记录前端之间的连接较短,布线工作量小且可定制性高。ASIC的小尺寸(344μm×294μm)和超柔性基板具有低弯曲刚度,使植入物能够适应大脑的曲率并实现高结构生物相容性。我们介绍了实现NeuroBus所需的架构、集成构建模块和CMOS后工艺,并对原型直接数字化神经记录前端以及基于聚酰亚胺的皮层脑电图(ECoG)脑接口进行了表征。进一步使用啮齿动物模型来验证记录前端和薄膜电极阵列的联合能力。