Ikzibane Hafsa, Patil Akash, Canosa Jon, Okada Etienne, Blandre Etienne, Dubois Emmanuel, Robillard Jean-François
Univ. Lille, CNRS, Centrale Lille, Junia, Univ. Polytechnique Hauts-de-France, UMR 8520 - IEMN - Institut d'Electronique de Microélectronique et de Nanotechnologie F-59000 Lille, France.
STMicroelectronics - 850 rue jean Monnet 38920 Crolles France.
Mater Adv. 2024 Jun 4;5(14):5998-6006. doi: 10.1039/d4ma00095a. eCollection 2024 Jul 15.
Research towards efficient and environmentally friendly thermoelectrics proposes silicon nanostructures as possible candidates through reduction of the phononic thermal conductivity. However, there is scarce literature about experimental measurements of the thermoelectric figure-of-merit on actual crystalline silicon devices. This article reports on the fabrication and full thermoelectric characterization of crystalline 60 nm thick membranes. To that end, an experiment with four types of built-in devices was designed using a silicon-on-insulator substrate to extract the Seebeck coefficient, electrical conductivity and thermal conductivity. The results show indeed a reduced thermal conductivity of 31 W m K for a 60 nm thick Si membrane and = 18 W m K for a porous Si membrane. This reflects an 88% reduction in thermal conductivity compared to the bulk Si material and a 42% reduction compared to plain Si membranes. In terms of power generation, the power factor of the fabricated devices surpasses that of state-of-the-art silicon thin films at room temperature. Notably, a figure of merit of 0.04 is reported for a 60 nm thick phonon-engineered Si membrane, which is considerably higher than that of bulk Si(0.001) but lower than previously reported results on other types of nano-objects.
对高效且环保的热电材料的研究提出,通过降低声子热导率,硅纳米结构可能是合适的候选材料。然而,关于实际晶体硅器件热电品质因数的实验测量的文献却很少。本文报道了60纳米厚晶体膜的制备及其完整的热电特性。为此,利用绝缘体上硅衬底设计了一个包含四种内置器件的实验,以提取塞贝克系数、电导率和热导率。结果表明,对于60纳米厚的硅膜,其热导率确实降低至31W/(m·K),对于多孔硅膜则为18W/(m·K)。这反映出与块状硅材料相比热导率降低了88%,与普通硅膜相比降低了42%。在发电方面,所制备器件的功率因数在室温下超过了现有最先进的硅薄膜。值得注意的是,对于60纳米厚的声子工程硅膜,报道的品质因数为0.04,这比块状硅(0.001)高得多,但低于先前报道的其他类型纳米物体的结果。