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铜钛夹心靶溅射过程中衬底热流的研究

Study of Heat Flow at Substrate during Sputtering of Copper-Titanium Sandwich Target.

作者信息

Shapovalov Viktor I, Sharkovskii Daniil S

机构信息

Department of Physical Electronics and Technology, St. Petersburg Electrotechnical University "LETI", Prof. Popov str., 5F, St. Petersburg 197022, Russia.

出版信息

Materials (Basel). 2024 Jul 21;17(14):3599. doi: 10.3390/ma17143599.

DOI:10.3390/ma17143599
PMID:39063891
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11279351/
Abstract

The purpose of this work is to study the kinetics of the heat flow heating the substrate, which is generated by a two-layer sandwich magnetron target when sputtered in argon. Its novelty resides in the application of the COMSOL Multiphysics to study the kinetics of thermal processes during sputtering of a target of the new type. The analysis was performed for a sandwich target with internal copper and external titanium plates when the discharge power varied in the range of 400-1200 W. The heating of the external target plate is described by a two-dimensional homogeneous Fourier equation. The solution to the equation reveals how the kinetics of the external plate's surface temperature distribution depends on the discharge power. To study the heat flow heating the substrate, the external plate is presented in the form of an additive set of small-sized surface heat sources. Previously unknown features of the thermal process are established. It is shown that numerical modeling adequately describes the experimental results.

摘要

这项工作的目的是研究由双层三明治磁控管靶在氩气中溅射时加热衬底所产生的热流动力学。其新颖之处在于应用COMSOL Multiphysics来研究新型靶溅射过程中的热过程动力学。当放电功率在400 - 1200 W范围内变化时，对具有内部铜板和外部钛板的三明治靶进行了分析。外部靶板的加热由二维齐次傅里叶方程描述。该方程的解揭示了外部板表面温度分布的动力学如何依赖于放电功率。为了研究加热衬底的热流，将外部板表示为一组小尺寸表面热源的叠加形式。确定了热过程以前未知的特征。结果表明，数值模拟充分描述了实验结果。

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Materials (Basel). 2022 Mar 18;15(6):2245. doi: 10.3390/ma15062245.