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基于MEMS的非制冷红外传感器的晶圆级真空封装。

Wafer Level Vacuum Packaging of MEMS-Based Uncooled Infrared Sensors.

作者信息

Demirhan Aydin Gulsah, Akar Orhan Sevket, Akin Tayfun

机构信息

METU MEMS Centre, Middle East Technical University, Ankara 06530, Turkey.

Electrical and Electronics Engineering Department, Baskent University, Ankara 06790, Turkey.

出版信息

Micromachines (Basel). 2024 Jul 23;15(8):935. doi: 10.3390/mi15080935.

DOI:10.3390/mi15080935
PMID:39203586
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11356317/
Abstract

This paper introduces a cost-effective, high-performance approach to achieving wafer level vacuum packaging (WLVP) for MEMS-based uncooled infrared sensors. Reliable and hermetic packages for MEMS devices are achieved using a cap wafer that is formed using two silicon wafers, where one wafer has precise grating/moth-eye structures on both sides of a double-sided polished wafer for improved transmission of over 80% in the long-wave infrared (LWIR) wavelength region without the need for an AR coating, while the other wafer is used to form a cavity. The two wafers are bonded using Au-In transient liquid phase (TLP) bonding at low temperature to form the cap wafer, which is then bondelectrical and Electronics d to the sensor wafer using glass frit bonding at high temperature to activate the getter inside the cavity region. The bond quality is assessed using three methods, including He-leak tests, cap deflection, and Pirani vacuum gauges. Hermeticity is confirmed through He-leak tests according to MIL-STD 883, yielding values as low as 0.1 × 10 atm·cc/s. The average shear strength is measured as 23.38 MPa. The package pressure varies from 133-533 Pa without the getter usage to as low as 0.13 Pa with the getter usage.

摘要

本文介绍了一种经济高效、高性能的方法，用于实现基于MEMS的非制冷红外传感器的晶圆级真空封装（WLVP）。通过使用由两个硅晶圆形成的盖晶圆来实现MEMS器件的可靠且气密的封装，其中一个晶圆在双面抛光晶圆的两侧具有精确的光栅/蛾眼结构，以在无需增透膜的情况下，在长波红外（LWIR）波长区域实现超过80%的改进传输，而另一个晶圆用于形成腔体。这两个晶圆在低温下使用金-铟瞬态液相（TLP）键合进行键合以形成盖晶圆，然后在高温下使用玻璃料键合将其键合到传感器晶圆上，以激活腔体内区域的吸气剂。使用三种方法评估键合质量，包括氦泄漏测试、盖偏转和皮拉尼真空计。根据MIL-STD 883通过氦泄漏测试确认气密性，产生低至0.1×10 atm·cc/s的值。测量的平均剪切强度为23.38 MPa。封装压力在不使用吸气剂时为133 - 533 Pa，使用吸气剂时低至0.13 Pa。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/61e790a59385/micromachines-15-00935-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/f70ab9863e63/micromachines-15-00935-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/170b276114a1/micromachines-15-00935-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/c98f900167b1/micromachines-15-00935-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/e4cec03c00e2/micromachines-15-00935-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/21d159197334/micromachines-15-00935-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/aae02c993a79/micromachines-15-00935-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/c7850898975f/micromachines-15-00935-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/83c9f8347fcb/micromachines-15-00935-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/ca24c60dd4d1/micromachines-15-00935-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/b73f4c19acd3/micromachines-15-00935-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/a4dec368eec6/micromachines-15-00935-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/61e790a59385/micromachines-15-00935-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/f70ab9863e63/micromachines-15-00935-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/170b276114a1/micromachines-15-00935-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/c98f900167b1/micromachines-15-00935-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/e4cec03c00e2/micromachines-15-00935-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/21d159197334/micromachines-15-00935-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/aae02c993a79/micromachines-15-00935-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/c7850898975f/micromachines-15-00935-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/83c9f8347fcb/micromachines-15-00935-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/ca24c60dd4d1/micromachines-15-00935-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/b73f4c19acd3/micromachines-15-00935-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/a4dec368eec6/micromachines-15-00935-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d7af/11356317/61e790a59385/micromachines-15-00935-g012.jpg

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