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用于先进互补场效应晶体管和集成电路的二维半导体

Two-Dimensional Semiconductors for State-of-the-Art Complementary Field-Effect Transistors and Integrated Circuits.

作者信息

Liang Meng, Yan Han, Wazir Nasrullah, Zhou Changjian, Ma Zichao

机构信息

School of Microelectronics, South China University of Technology, Guangzhou 511442, China.

出版信息

Nanomaterials (Basel). 2024 Aug 28;14(17):1408. doi: 10.3390/nano14171408.

Abstract

As the trajectory of transistor scaling defined by Moore's law encounters challenges, the paradigm of ever-evolving integrated circuit technology shifts to explore unconventional materials and architectures to sustain progress. Two-dimensional (2D) semiconductors, characterized by their atomic-scale thickness and exceptional electronic properties, have emerged as a beacon of promise in this quest for the continued advancement of field-effect transistor (FET) technology. The energy-efficient complementary circuit integration necessitates strategic engineering of both n-channel and p-channel 2D FETs to achieve symmetrical high performance. This intricate process mandates the realization of demanding device characteristics, including low contact resistance, precisely controlled doping schemes, high mobility, and seamless incorporation of high- dielectrics. Furthermore, the uniform growth of wafer-scale 2D film is imperative to mitigate defect density, minimize device-to-device variation, and establish pristine interfaces within the integrated circuits. This review examines the latest breakthroughs with a focus on the preparation of 2D channel materials and device engineering in advanced FET structures. It also extensively summarizes critical aspects such as the scalability and compatibility of 2D FET devices with existing manufacturing technologies, elucidating the synergistic relationships crucial for realizing efficient and high-performance 2D FETs. These findings extend to potential integrated circuit applications in diverse functionalities.

摘要

随着由摩尔定律定义的晶体管缩放轨迹面临挑战,不断发展的集成电路技术范式转向探索非常规材料和架构以持续进步。二维(2D)半导体以其原子级厚度和卓越的电子特性为特征,在这场追求场效应晶体管(FET)技术持续进步的探索中成为了希望的灯塔。节能互补电路集成需要对n沟道和p沟道2D FET进行战略工程设计,以实现对称的高性能。这个复杂的过程要求实现苛刻的器件特性,包括低接触电阻、精确控制的掺杂方案、高迁移率以及高介电常数材料的无缝集成。此外,晶圆级2D薄膜的均匀生长对于降低缺陷密度、最小化器件间变化以及在集成电路中建立纯净界面至关重要。本综述考察了最新突破,重点关注先进FET结构中2D沟道材料的制备和器件工程。它还广泛总结了诸如2D FET器件与现有制造技术的可扩展性和兼容性等关键方面,阐明了对于实现高效和高性能2D FET至关重要的协同关系。这些发现延伸到了具有多种功能的潜在集成电路应用。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/cca1/11397490/e7e7f488edad/nanomaterials-14-01408-g005.jpg

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