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铸造工艺和热暴露对Al-Si-Cu-Ni合金微观结构及力学性能的影响

Effect of Casting Process and Thermal Exposure on Microstructure and Mechanical Properties of Al-Si-Cu-Ni Alloy.

作者信息

Xiao Peijie, Xu Shiwei, Chen Longbao, Liu Yu, Li Jianyu, Xiao Zhi, Meng Xianming

机构信息

State Key Laboratory of Advanced Design and Manufacturing Technology for Vehicle, College of Mechanical and Vehicle Engineering, Hunan University, Changsha 410082, China.

Suzhou Research Institute of Hunan University, Suzhou 215131, China.

出版信息

Materials (Basel). 2024 Sep 19;17(18):4598. doi: 10.3390/ma17184598.

Abstract

This paper employed squeeze-casting (SC) technology to develop a novel Al-7Si-1.5Cu-1.2Ni-0.4Mg-0.3Mn-0.15Ti heat-resistant alloy, addressing the issue of low room/high temperature elongation in traditional gravity casting (GC). Initially, the effects of SC and GC processes on the microstructure and properties of the alloy were investigated, followed by an examination of the evolution of the microstructure and properties of the SC samples over thermal exposure time. The results indicate that the SC process significantly improves the alloy's microstructure. Compared to the GC alloy, the secondary dendrite arm spacing of the as-cast SC alloy is refined from 50.5 μm to 18.5 μm. Meanwhile, the size and roundness of the eutectic Si phase in the T6-treated SC alloy are optimized from 11.7 μm and 0.75 μm to 9.5 μm and 0.85 μm, respectively, and casting defects such as porosity are reduced. Consequently, the ultimate tensile strengths (UTSs) at room temperature and at 250 °C of the SC alloy are 5% and 4.9% higher than that of GC alloy, respectively, and its elongation at both temperatures shows significant improvement. After thermal exposure at 250 °C for 120 h, the morphology of the residual second phase at the grain boundaries in the SC alloy becomes more rounded, but the eutectic Si and nano-precipitates undergo significant coarsening, resulting in a 49% decrease in UTS.

摘要

本文采用挤压铸造(SC)技术开发了一种新型Al-7Si-1.5Cu-1.2Ni-0.4Mg-0.3Mn-0.15Ti耐热合金,以解决传统重力铸造(GC)中室温/高温伸长率低的问题。首先,研究了SC和GC工艺对合金微观结构和性能的影响,随后考察了SC样品在热暴露时间内微观结构和性能的演变。结果表明,SC工艺显著改善了合金的微观结构。与GC合金相比,铸态SC合金的二次枝晶臂间距从50.5μm细化至18.5μm。同时,T6处理后的SC合金中共晶硅相的尺寸和圆度分别从11.7μm和0.75μm优化至9.5μm和0.85μm,气孔等铸造缺陷减少。因此,SC合金在室温及250℃时的抗拉强度分别比GC合金高5%和4.9%,且其在这两个温度下的伸长率均有显著提高。在250℃热暴露120小时后,SC合金晶界处残余第二相的形态变得更圆,但共晶硅和纳米析出相发生明显粗化,导致抗拉强度下降49%。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a1de/11433571/810aa60cd220/materials-17-04598-g001.jpg

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